RFMD’s SBF5089Z is a high performance InGaP/GaAs Heterojunction Bipolar Tran-
sistor MMIC Amplifier. A Darlington configuration designed with InGaP process tech-
nology provides broadband performance up to 0.5GHz with excellent thermal
performance. The heterojunction increases breakdown voltage and minimizes leak-
age current between junctions. Cancellation of emitter junction non-linearities
results in higher suppression of intermodulation products. Only a single positive
supply voltage, DC-blocking capacitors, a bias resistor, and an optional RF choke
are required for operation.
Optimum Technology
Matching® Applied
GaAs HBT
25
22.5
20
17.5
15
12.5
10
7.5
5
0
100
200
300
400
500
600
700
800
S21
S11
S22
Features
IP
3
=41dBm at 240MHz
Stable Gain Over
Temperature
Robust 1000V ESD, Class 1C
Operates From Single Supply
Low Thermal Resistance
Receiver IF Applications
Cellular, PCS, GSM, UMTS
IF Amplifier
Wireless Data, Satellite
Terminals
*DLQ
5HWXUQ /RVV YHUVXV )UHTXHQF\ &
0
-5
-10
-15
-20
-25
-30
-35
-40
900
Applications
,5/ 25/ G%
GaAs MESFET
InGaP HBT
SiGe BiCMOS
*DLQG%
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
InP HBT
RF MEMS
LDMOS
)UHTXHQF\0+]
Parameter
Small Signal Gain
Min.
Specification
Typ.
Max.
Unit
Condition
20.5
dB
70MHz
18.5
20.0
21.5
dB
240MHz
18.0
19.5
21.0
dB
500MHz
Output Power at 1dB Compression
21
dBm
70MHz
21
dBm
240MHz
19.2
20.7
dBm
400MHz
Output Third Order Intercept Point
39.0
dBm
70MHz
41.0
dBm
240MHz
37.5
39.5
dBm
400MHz
Input Return Loss
14
18
dB
500MHz
Output Return Loss
12.0
16.0
dB
500MHz
Noise Figure
2.8
3.8
dB
500MHz
Device Operating Voltage
4.5
4.9
5.3
V
Device Operating Current
82
90
98
mA
Thermal Resistance
43
°C/W
junction to lead
Test Conditions: V
S
=8V, I
D
=90mA Typ., T
L
=25°C. OIP
3
Tone Spacing=1MHz, P
OUT
per tone=0dBm, R
BIAS
=33. Data with Application Circuit.
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-