TC Zener Diode Chip Series
CD821 thru CD829A
Available in JANHC and JANKC per MIL-PRF-19500/159
Features
•
•
•
•
Monolithic Temperature Compensated Zener Reference Chips
All junctions completely protected with silicon dioxide
Electrically equivalent to 1N821 thru 1N829A
Compatible with all wire bonding and die attach
techniques with the exception of solder reflow
Maximum Ratings
Operating Temperature:
Storage Temperature:
Reverse Leakage Current:
-65°C to +175°C
-65°C to +175°C
lR = 2 μA @ 25 °C & VR = 3 Vdc
Electrical Specifications @ +25 ºC (Unless Otherwise Specified)
ZENER
VOLTAGE
ZENER TEST
CURRENT
IZT
mA
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
MAXIMUM
ZENER
IMPEDANCE
ZZT (Note 1)
OHMS
15
13
15
13
15
13
15
15
13
15
15
13
-55° to +100°
VOLTAGE
TEMPERATURE
STABILITY
3V
ZT (Note 2)
mV
96
96
48
48
19
19
20
9
9
10
5
5
% / °C
0.01
0.01
0.005
0.005
0.002
0.002
0.002
0.001
0.001
0.001
0.0005
0.0005
EFFECTIVE
TEMPERATURE
COEFFICIENT
TYPE
NUMBER
VZT @ IZT
VOLTS
CD821
CD821A
CD823
CD823A
CD825
CD825A
CD826
CD827
CD827A
CD828
CD829
CD829A
NOTE 1
NOTE 2
5.9 – 6.5
5.9 – 6.5
5.9 – 6.5
5.9 – 6.5
5.9 – 6.5
5.9 – 6.5
5.9 – 6.5
5.9 – 6.5
5.9 – 6.5
6.2 – 6.9
5.9 – 6.5
5.9 – 6.5
Zener impedance is derived by superimposing on l ZT a 60 Hz rms ac current equal to 10% of l ZT.
The maximum allowable change observed over the entire temperature range i.e.,the diode voltage will not
exceed the specialized mV at any discrete temperature between the established limits, per JEDEC standard No.5.
Revision Date: 10/28/2013
1
CD821 thru CD829A
TYPICAL CHANGE OF TEMPERATURE COEFFICIENT
WITH CHANGE IN OPERATING CURRENT
500
ZENER IMPEDANCE ZZT (OHMS)
100
50
10
5
1
5
6
7
8
9
10
OPERATING CURRENT lZT (mA)
ZENER IMPEDANCE
VS.
OPERATING CURRENT
CHANGE IN TEMPERATURE COEFFICIENT ( %/°C)
+.0010
+.0005
0
-.0005
-.0010
5.5
6.0
6.5
7.0
7.5
8.0
8.5
OPERATING CURRENT lZT (mA)
9.0
9.5
TYPICAL CHANGE OF TEMPERATURE COEFFICIENT
WITH CHANGE IN OPERATING CURRENT
2
TEL: 888-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Revision Date: 10/28/2013
CD821 thru CD829A
Outline Drawing
DESIGN DATA
METALLIZATION:
Top:
Back:
AL THICKNESS:
A
C
GOLD THICKNESS:
CHIP THICKNESS:
25,000 Å Minimum
4,000 Å Minimum
10 Mils
C (Cathode)
A (Anode)
Al
Al
Au
CIRCUIT LAYOUT DATA: Backside must be electrically isolated.
Backside is not cathode: For Zener operation cathode must be operated
positive with respect to anode.
TEL: 888-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics
Revision Date: 10/28/2013
3
CD4565 thru CD4584A
Aeroflex / Metelics, Inc.
975 Stewart Drive,
Sunnyvale, CA 94085
Tel: (408) 737-8181
Fax: (408) 733-7645
Sales: 888-641-SEMI (7364)
Hi-Rel Components
9 Hampshire Street,
Lawrence, MA 01840
Tel: (603) 641-3800
Fax: (978) 683-3264
www.aeroflex.com/metelicsHRC
54 Grenier Field Road,
Londonderry, NH 03053
Tel: (603) 641-3800
Fax: (603)-641-3500
ISO 9001: 2008 certified companies
www.aeroflex.com/metelics
metelics-sales@aeroflex.com
Aeroflex / Metelics, Inc. reserves the right to make changes to any products and services
herein at any time without notice. Consult Aeroflex or an authorized sales representative to
verify that the information in this data sheet is current before using this product. Aeroflex
does not assume any responsibility or liability arising out of the application or use of any
product or service described herein, except as expressly agreed to in writing by Aeroflex;
nor does the purchase, lease, or use of a product or service from Aeroflex convey a license
under any patent rights, copyrights, trademark rights, or any other of the intellectual rights
of Aeroflex or of third parties.
Copyright 2013 Aeroflex / Metelics. All rights reserved.
Revision Date: 10/28/2013
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