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LH28F640BFHG-PBTL70A

产品描述Flash, 4MX16, 70ns, PBGA48, 8 X 8 MM, 0.75 MM PITCH, PLASTIC, FBGA-48
产品类别存储    存储   
文件大小492KB,共39页
制造商SHARP
官网地址http://sharp-world.com/products/device/
下载文档 详细参数 全文预览

LH28F640BFHG-PBTL70A概述

Flash, 4MX16, 70ns, PBGA48, 8 X 8 MM, 0.75 MM PITCH, PLASTIC, FBGA-48

LH28F640BFHG-PBTL70A规格参数

参数名称属性值
厂商名称SHARP
包装说明TFBGA,
Reach Compliance Codeunknown
最长访问时间70 ns
JESD-30 代码S-PBGA-B48
长度8 mm
内存密度67108864 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
端子数量48
字数4194304 words
字数代码4000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织4MX16
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装形状SQUARE
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行PARALLEL
编程电压1.8 V
认证状态Not Qualified
座面最大高度1.05 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距0.75 mm
端子位置BOTTOM
类型NOR TYPE
宽度8 mm

LH28F640BFHG-PBTL70A文档预览

P
RELIMINARY
P
RODUCT
S
PECIFICATION
Integrated Circuits Group
LH28F640BFHG-PBTL70A
Flash Memory
64Mbit (4Mbitx16)
(Model Number: LHF64FH9)
Spec. Issue Date: September 27, 2004
Spec No: FM045022A
LHF64FH9
Handle this document carefully for it contains material protected by international copyright law. Any reproduction,
full or in part, of this material is prohibited without the express written permission of the company.
When using the products covered herein, please observe the conditions written herein and the precautions outlined in
the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly
adhere to these conditions and precautions.
(1) The products covered herein are designed and manufactured for the following application areas. When using the
products covered herein for the equipment listed in Paragraph (2), even for the following application areas, be sure
to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph
(3).
Office electronics
Instrumentation and measuring equipment
Machine tools
Audiovisual equipment
Home appliance
Communication equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following equipment which demands high
reliability, should first contact a sales representative of the company and then accept responsibility for
incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring
reliability and safety of the equipment and the overall system.
Control and safety devices for airplanes, trains, automobiles, and other transportation equipment
Mainframe computers
Traffic control systems
Gas leak detectors and automatic cutoff devices
Rescue and security equipment
Other safety devices and safety equipment, etc.
(3) Do not use the products covered herein for the following equipment which demands extremely high performance
in terms of functionality, reliability, or accuracy.
Aerospace equipment
Communications equipment for trunk lines
Control equipment for the nuclear power industry
Medical equipment related to life support, etc.
(4) Please direct all queries and comments regarding the interpretation of the above three Paragraphs to a sales
representative of the company.
Please direct all queries regarding the products covered herein to a sales representative of the company.
Rev. 2.45
LHF64FH9
1
CONTENTS
PAGE
0.75mm pitch 48-Ball CSP Pinout ............................. 3
Pin Descriptions.......................................................... 4
Simultaneous Operation Modes
Allowed with Four Planes .................................. 5
Memory Map .............................................................. 6
PAGE
Extended Status Register Definition ......................... 15
Partition Configuration Register Definition.............. 16
Partition Configuration ............................................. 16
1 Electrical Specifications......................................... 17
1.1 Absolute Maximum Ratings ........................... 17
Identifier Codes and OTP Address
for Read Operation ............................................. 7
Identifier Codes and OTP Address for
Read Operation on Partition Configuration........ 7
OTP Block Address Map for OTP Program............... 8
1.2 Operating Conditions ...................................... 17
1.2.1 Capacitance .............................................. 18
1.2.2 AC Input/Output Test Conditions ............ 18
1.2.3 DC Characteristics ................................... 19
Bus Operation............................................................. 9
Command Definitions .............................................. 10
Functions of Block Lock and Block Lock-Down..... 12
Block Locking State Transitions upon
Command Write................................................ 12
Block Locking State Transitions upon
WP# Transition................................................. 13
Status Register Definition......................................... 14
2 Related Document Information.............................. 29
1.2.4 AC Characteristics
- Read-Only Operations......................... 21
1.2.5 AC Characteristics
- Write Operations ................................. 25
1.2.6 Reset Operations ...................................... 27
1.2.7 Block Erase, Full Chip Erase,
(Page Buffer) Program and
OTP Program Performance.................... 28
Rev. 2.45
LHF64FH9
2
LH28F640BFHG-PBTL70A
64Mbit (4Mbit×16)
Page Mode Dual Work Flash MEMORY
64M density with 16Bit I/O Interface
High Performance Reads
• 70/30ns 8-Word Page Mode
Configurative 4-Plane Dual Work
• Flexible Partitioning
• Read operations during Block Erase or (Page Buffer)
Program
• Status Register for Each Partition
Low Power Operation
• 2.7V Read and Write Operations
• V
CCQ
for Input/Output Power Supply Isolation
• Automatic Power Savings Mode Reduces I
CCR
in Static Mode
Enhanced Code + Data Storage
• 5µs Typical Erase/Program Suspends
OTP (One Time Program) Block
• 4-Word Factory-Programmed Area
• 4-Word User-Programmable Area
High Performance Program with Page Buffer
• 16-Word Page Buffer
• 5µs/Word (Typ.) at 9.5V V
PP
Operating Temperature -40°C to +85°C
CMOS Process (P-type silicon substrate)
Flexible Blocking Architecture
• Eight 4K-word Parameter Blocks
• One-hundred and twenty-seven 32K-word Main
Blocks
• Bottom Parameter Location
Enhanced Data Protection Features
• Individual Block Lock and Block Lock-Down with
Zero-Latency
• All blocks are locked at power-up or device reset.
• Absolute Protection with V
PP
≤V
PPLK
• Block Erase, Full Chip Erase, (Page Buffer) Word
Program Lockout during Power Transitions
Automated Erase/Program Algorithms
• 3.0V Low-Power
11µs/Word
(Typ.)
Programming
• 9.5V No Glue Logic 9µs/Word (Typ.)
Production Programming and 0.5s Erase (Typ.)
Cross-Compatible Command Support
• Basic Command Set
• Common Flash Interface (CFI)
Extended Cycling Capability
• Minimum 100,000 Block Erase Cycles
0.75mm pitch 48-Ball CSP
ETOX
TM*
Flash Technology
Not designed or rated as radiation hardened
The product, which is 4-Plane Page Mode Dual Work (Simultaneous Read while Erase/Program) Flash memory, is a low
power, high density, low cost, nonvolatile read/write storage solution for a wide range of applications. The product can
operate at V
CC
=2.7V-3.6V and V
PP
=1.65V-3.6V or 9.0V-10.0V. Its low voltage operation capability greatly extends
battery life for portable applications.
The product provides high performance asynchronous page mode. It allows code execution directly from Flash, thus
eliminating time consuming wait states. Furthermore, its newly configurative partitioning architecture allows flexible dual
work operation.
The memory array block architecture utilizes Enhanced Data Protection features, and provides separate Parameter and Main
Blocks that provide maximum flexibility for safe nonvolatile code and data storage.
Fast program capability is provided through the use of high speed Page Buffer Program.
Special OTP (One Time Program) block provides an area to store permanent code such as a unique number.
* ETOX is a trademark of Intel Corporation.
Rev. 2.45
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