* 250 piece packs supplied in sealed bags of cut tape length
1773270 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
SMD High Power Precision Resistors
Type RN73 Series
Paper Tape Specification
Type
RN73 1J (0603)
A
1.10 ±0.05
B
1.16 ±0.05
1.90 ±0.05
2.37 ±0.05
3.55 ±0.05
3.40 ±0.05
W
8.00 ±0.10
8.00 ±0.10
8.00 ±0.10
8.00 ±0.10
8.00 ±0.10
E
1.75 ±0.05
1.75 ±0.05
1.75 ±0.05
1.75 ±0.05
1.75 ±0.05
F
3.5 ±0.05
3.5 ±0.05
3.5 ±0.05
3.5 ±0.05
3.5 ±0.05
P
0
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.05
P
1
2.00 ±0.05
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
P
2
øD
0
T
0.40 ±0.03
0.60 ±0.03
0.75 ±0.05
0.75 ±0.05
0.75 ±0.05
RN73 1E (0402)
0.70 ±0.05
RN73 2A (0805)
1.60 ±0.05
RN73 2B (1206)
2.00 ±0.05
RN73 2E (1210)
2.75 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.55 ±0.05
2.00 ±0.05 1.60 ±0.10
Embossed Plastic Tape Specifications
Type
RN73 2H (2010)
RN73 3A (2512)
A
2.85 ±0.10
3.40 ±0.10
B
5.45 ±0.10
6.65 ±0.10
W
12.0 ±0.10
12.0 ±0.10
E
1.75 ±0.10
1.75 ±0.10
F
5.5 ±0.05
5.5 ±0.05
P
0
4.00 ±0.05
4.00 ±0.05
P
1
4.00 ±0.10
4.00 ±0.10
P
2
øD
0
T
2.00 ±0.05 1.50 +0.10 1.00 ±0.20
2.00 ±0.05 1.50 +0.10 1.00 ±0.20
How to Order
RN73
Common Part
C
Temp. Coefficient
2A
Package Size
1E - 0402
* 1J - 0603
* 2A - 0805
RN73 - High
precision resistors
(RoHS compliant)
A - ±5ppm/°C
* C - ±10ppm/°C
2B - 1206
2E - 1210
2H - 2010
3A - 2512
* Preferred stock item
* Preferred stock item
100R
(100 ohms)
1K0
(1000 ohms)
100K
(100,000 ohms)
* Preferred stock item
A - ±0.05%
*B - ±0.1%
L - ±0.01%
100K
Resistor Value
B
Tolerance
TDF
Packaging
TG - 250 Cut tape
length (1E, 1J, 2A, 2B)
TDF -1000 REEL
(1E, 1J, 2A, 2B)
TD - 5000 REEL
(1E, 1J, 2A, 2B, 2E)
TDG - 250 REEL
(1E, 1J, 2A only)
TE - 4000 REEL
(2H, 3A only)
TE Connectivity, TE connectivity (logo) and TE (logo) are trademarks.
Other logos, product and Company names mentioned herein may be trademarks of their respective owners.
While TE has made every reasonable effort to ensure the accuracy of the information in this datasheet, TE does not guarantee that it is error-free, nor does TE make any other
representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein
at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantabili-
ty or fitness for a particular purpose. The dimensions in this datasheet are for reference purposes only and are subject to change without notice. Specifications are subject to change
without notice. Consult TE for the latest dimensions and design specifications.
国际半导体设备材料产业协会（SEMI）昨（10）日公布半导体设备资本支出的年中预测报告（SEMI Capital Equipment Forecast），预估2012年全球半导体设备营收规模将达到423.8亿美元，2013年将成长至467.1亿美元。
受惠平板电脑、智慧型手机与行动装置等消费性电子商品亮丽表现，半导体设备的采购需求仍将持续。SEMI在报告中指出，2011年半...[详细]
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