Flash, 1MX8, 120ns, PDSO44, PLASTIC, SOP-44
| 参数名称 | 属性值 |
| 厂商名称 | FUJITSU(富士通) |
| 包装说明 | PLASTIC, SOP-44 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 120 ns |
| 其他特性 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 |
| 启动块 | BOTTOM |
| JESD-30 代码 | R-PDSO-G44 |
| 长度 | 28.45 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 组织 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.5 mm |
| 最大供电电压 (Vsup) | 3.3 V |
| 最小供电电压 (Vsup) | 2.8 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 类型 | NOR TYPE |
| 宽度 | 13 mm |
| MBM29DL800B-12PF | MBM29DL800B-10PFTR | MBM29DL800B-12PFTN | MBM29DL800B-12PFTR | MBM29DL800B-10PFTN | MBM29DL800B-10PF | MBM29DL800T-12PFTN | MBM29DL800T-10PFTR | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 1MX8, 120ns, PDSO44, PLASTIC, SOP-44 | Flash, 1MX8, 100ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | Flash, 1MX8, 120ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 1MX8, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | Flash, 1MX8, 100ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 1MX8, 100ns, PDSO44, PLASTIC, SOP-44 | Flash, 1MX8, 120ns, PDSO48, PLASTIC, TSOP1-48 | Flash, 1MX8, 100ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 |
| 厂商名称 | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) |
| 包装说明 | PLASTIC, SOP-44 | PLASTIC, REVERSE, TSOP1-48 | PLASTIC, TSOP1-48 | PLASTIC, REVERSE, TSOP1-48 | PLASTIC, TSOP1-48 | PLASTIC, SOP-44 | PLASTIC, TSOP1-48 | PLASTIC, REVERSE, TSOP1-48 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 120 ns | 100 ns | 120 ns | 120 ns | 100 ns | 100 ns | 120 ns | 100 ns |
| 其他特性 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 | MINIMUM 100000 PROGRAM/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16 |
| 启动块 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | TOP | TOP |
| JESD-30 代码 | R-PDSO-G44 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G44 | R-PDSO-G48 | R-PDSO-G48 |
| 长度 | 28.45 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 28.45 mm | 18.4 mm | 18.4 mm |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 48 | 48 | 48 | 48 | 44 | 48 | 48 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSOP1-R | TSOP1 | TSOP1-R | TSOP1 | SOP | TSOP1 | TSOP1-R |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.5 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 2.5 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 13 mm | 12 mm | 12 mm | 12 mm | 12 mm | 13 mm | 12 mm | 12 mm |
DSP 与 ARM 处理器
嵌入式系统
机器人开发
stm32/stm8
嵌入式系统
测试/测量
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