SPECIALTY TELECOM CIRCUIT, QCC20
专业电信电路, QCC20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | SEMTECH |
| 零件包装代码 | QFN |
| 包装说明 | 3 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, 0.40 MM PITCH, QFN-20 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| JESD-30 代码 | S-XQCC-N20 |
| 长度 | 3 mm |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.6 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.4 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| SX1504I087TRT | GRM0333C1H2R9CA01 | SX1504I088TRT | SX1505I088TRT | SX1506I091TRT | SX1506I089TRT | |
|---|---|---|---|---|---|---|
| 描述 | SPECIALTY TELECOM CIRCUIT, QCC20 | Temperature coefficient | SPECIALTY TELECOM CIRCUIT, QCC20 | SPECIALTY TELECOM CIRCUIT, QCC20 | SPECIALTY TELECOM CIRCUIT, QCC28 | SPECIALTY TELECOM CIRCUIT, QCC20 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | SEMTECH | - | SEMTECH | SEMTECH | SEMTECH | SEMTECH |
| 零件包装代码 | QFN | - | TSSOP | TSSOP | QFN | TSSOP |
| 包装说明 | 3 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, 0.40 MM PITCH, QFN-20 | - | TSSOP, | TSSOP, | HVQCCN, | TSSOP, |
| 针数 | 20 | - | 20 | 20 | 28 | 28 |
| Reach Compliance Code | compli | - | compli | compli | compli | compli |
| JESD-30 代码 | S-XQCC-N20 | - | R-PDSO-G20 | R-PDSO-G20 | S-XQCC-N28 | R-PDSO-G28 |
| 长度 | 3 mm | - | 6.5 mm | 6.5 mm | 4 mm | 9.7 mm |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | - | 20 | 20 | 28 | 28 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | TSSOP | TSSOP | HVQCCN | TSSOP |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.6 mm | - | 1.2 mm | 1.2 mm | 0.6 mm | 1.2 mm |
| 标称供电电压 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES |
| 电信集成电路类型 | TELECOM CIRCUIT | - | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | - | GULL WING | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.4 mm | - | 0.65 mm | 0.65 mm | 0.4 mm | 0.65 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | - | 4.4 mm | 4.4 mm | 4 mm | 4.4 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
