
Precision Low-Power LVPECL Line Driver/Receiver with Internal Termination
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, |
| 针数 | 8 |
| 制造商包装代码 | MLF |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 其他特性 | CAN ALSO OPERATE AT 3.3V SUPPLY |
| 差分输出 | YES |
| 驱动器位数 | 1 |
| 输入特性 | DIFFERENTIAL |
| 接口集成电路类型 | LINE RECEIVER |
| 接口标准 | GENERAL PURPOSE |
| JESD-30 代码 | S-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 2 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 认证状态 | Not Qualified |
| 最大接收延迟 | 0.36 ns |
| 接收器位数 | 1 |
| 座面最大高度 | 0.9 mm |
| 最大供电电压 | 2.625 V |
| 最小供电电压 | 2.375 V |
| 标称供电电压 | 2.5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 最大传输延迟 | 0.36 ns |
| 宽度 | 2 mm |
| SY89850UMGTR | SY89850U_07 | SY89850UMG | |
|---|---|---|---|
| 描述 | Precision Low-Power LVPECL Line Driver/Receiver with Internal Termination | Precision Low-Power LVPECL Line Driver/Receiver with Internal Termination | Precision Low-Power LVPECL Line Driver/Receiver with Internal Termination |
| 是否Rohs认证 | 符合 | - | 符合 |
| 厂商名称 | Microchip(微芯科技) | - | Microchip(微芯科技) |
| 包装说明 | HVSON, | - | MLF-8 |
| Reach Compliance Code | compli | - | compli |
| ECCN代码 | EAR99 | - | EAR99 |
| 其他特性 | CAN ALSO OPERATE AT 3.3V SUPPLY | - | CAN ALSO OPERATE AT 3.3V SUPPLY |
| 差分输出 | YES | - | YES |
| 驱动器位数 | 1 | - | 1 |
| 输入特性 | DIFFERENTIAL | - | DIFFERENTIAL |
| 接口集成电路类型 | LINE RECEIVER | - | LINE RECEIVER |
| 接口标准 | GENERAL PURPOSE | - | GENERAL PURPOSE |
| JESD-30 代码 | S-PDSO-N8 | - | R-XDSO-N8 |
| JESD-609代码 | e4 | - | e4 |
| 长度 | 2 mm | - | 2 mm |
| 湿度敏感等级 | 1 | - | 1 |
| 功能数量 | 1 | - | 1 |
| 端子数量 | 8 | - | 8 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | UNSPECIFIED |
| 封装代码 | HVSON | - | HVSON |
| 封装形状 | SQUARE | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | - | 260 |
| 认证状态 | Not Qualified | - | Not Qualified |
| 最大接收延迟 | 0.36 ns | - | 0.36 ns |
| 接收器位数 | 1 | - | 1 |
| 座面最大高度 | 0.9 mm | - | 0.95 mm |
| 最大供电电压 | 2.625 V | - | 2.625 V |
| 最小供电电压 | 2.375 V | - | 2.375 V |
| 标称供电电压 | 2.5 V | - | 2.5 V |
| 表面贴装 | YES | - | YES |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | - | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.5 mm |
| 端子位置 | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 |
| 最大传输延迟 | 0.36 ns | - | 0.36 ns |
| 宽度 | 2 mm | - | 2 mm |
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