Sample and Hold Circuit, 1 Func, Track, 0.01us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Data Device Corporation |
| 零件包装代码 | DIP |
| 包装说明 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长采集时间 | 0.015 µs |
| 标称采集时间 | 0.01 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 1 V |
| 最小模拟输入电压 | -1 V |
| 最大下降率 | 10000 V/s |
| JESD-30 代码 | R-CDIP-P24 |
| JESD-609代码 | e0 |
| 负供电电压上限 | -18 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 65 mA |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| TH-8530-3-N-B | TH-8530-3-B-B | TH-8530-3-B-10-B | TH-8530-3-N-10-B | TH-8530-3-P-10-B | TH-8530-3-P-B | |
|---|---|---|---|---|---|---|
| 描述 | Sample and Hold Circuit, 1 Func, Track, 0.01us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.01us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.01us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.01us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.01us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.01us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | DIP, | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长采集时间 | 0.015 µs | 0.015 µs | 0.015 µs | 0.015 µs | 0.015 µs | 0.015 µs |
| 标称采集时间 | 0.01 µs | 0.01 µs | 0.01 µs | 0.01 µs | 0.01 µs | 0.01 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| 最小模拟输入电压 | -1 V | -1 V | -1 V | -1 V | -1 V | -1 V |
| 最大下降率 | 10000 V/s | 10000 V/s | 10000 V/s | 10000 V/s | 10000 V/s | 10000 V/s |
| JESD-30 代码 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负供电电压上限 | -18 V | -18 V | -18 V | -18 V | -18 V | -18 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | 65 mA | 65 mA | 65 mA | 65 mA | 65 mA | 65 mA |
| 供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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