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PT7C5027B4-2WF

产品描述Clock Generator, CMOS, WAFER-6
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小388KB,共8页
制造商Pericom Technology Inc
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PT7C5027B4-2WF概述

Clock Generator, CMOS, WAFER-6

PT7C5027B4-2WF规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Pericom Technology Inc
零件包装代码WAFER
包装说明WAFER-6
针数6
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-30 代码R-XUUC-N6
JESD-609代码e0
端子数量6
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码DIE
封装形状RECTANGULAR
封装形式UNCASED CHIP
峰值回流温度(摄氏度)240
主时钟/晶体标称频率60 MHz
认证状态Not Qualified
最大供电电压5 V
最小供电电压1.5 V
标称供电电压1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式NO LEAD
端子位置UPPER
处于峰值回流温度下的最长时间30
uPs/uCs/外围集成电路类型CLOCK GENERATOR, OTHER

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Data Sheet
PT7C5027 series
Crystal Oscillator
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features
Wide range of operating supply voltage: 1.50V to
5.0V
Regulated voltage drive oscillator circuit for
reduced power consumption and crystal drive
current
Optimized low crystal drive current oscillation for
miniature crystal units
PT7C5027Axseries: for Flip Chip Bonding
PT7C5027Bxseries: for Wire Bonding (type
Ⅰ)
PT7C5027Cxseries: for Wire Bonding (type
Ⅱ)
Recommended oscillation frequency range
Low frequency version: 20MHz to 60MHz
Multi-stage frequency divider for low-frequency
output support: 0.9MHz(min)
Frequency divider built-in:
Selectable by version: f0, f0/2, f0/4, f0/8, f0/16,
f0/32, f0/64
-40 to 85℃ operating temperature range
Standy function
High impedence in standby mode, oscillator stops
CMOS output duty level(1/2VDD)
50±5% output duty
15pF output drive capability
Die form or Wafer form
PT7C
PT7C
Device Type
Clock Series
XO 5027 Series
5014
5027
A
Description
The PT7C5027 series are miniature crystal
oscillator module ICs. The oscillator circuit stage has
voltage regulator drive, significantly reducing current
consumption and crystal current, compared with
existing devices, and significantly reducing the
oscillator characteristics supply voltage dependency.
Application
Used for crystal oscillator
Ordering Information
Part no.
PT7C5027Ax-2WF
PT7C5027Bx-2DE
PT7C5027Bx-2WF
PT7C5027Cx-2DE
PT7C5027Cx-2WF
PT7C5027Cx-5GDE
Package type
Wafer form
Die form
Wafer form
Die form
Wafer form
Die form
Note:
1.Below is the detailed definition of part no.
2. “-2” means die thickness is 220±20µm; “-5G”
means die thickness is 130±15µm.
AL
1
1
Oscillation frequency range,
frequency divider function
Suffix
1
2
3
4
5
6
7
f
out
f
O
f
O
/2
f
O
/4
f
O
/8
f
O
/16
f
O
/32
f
O
/64
Frequency range
Pad layout type
A: for Flip Chip Bonding
B: for Wire Bonding(type I)
C: for Wire Bonding(type II)
20 to 60MHz
PT0276(08/07)
1
Ver:0

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