ASMT-Mxx9
Moonstone® 1W Power LED Light Source
Data Sheet
Description
The Moonstone® 1W Power LED Light Source is a high
performance energy efficient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to the
motherboard.
It is available in various color temperatures ranging from
2600K to 10000K.
The package is compatible with reflow soldering. To
facilitate easy pick and place assembly, the LEDs are also
available in EIA-compliant tape and reel.
The 1W Power LED light source can be mounted onto
metal core PCB enabling optimum heat dissipation and
ease of installation.
Features
x
Available in Cool White & Warm White color
x
Energy efficient
x
Exposed pad for excellent heat transfer
x
Suitable for reflow soldering process
x
High current operation
x
Long operation life
x
Wide viewing angle
x
Silicone encapsulation
x
Non-ESD sensitive (threshold >16kV)
x
MSL 4 products
Applications
x
Sign backlight, billboard illumination or backlight
x
Exit sign or emergency sign lightings
x
Commercial lightings
x
Accent and marker lightings
x
Pathway lighting
x
Task lighting
x
Reading lights
x
Decorative lighting
x
Garden lighting
x
Architectural lighting
x
Portable (flash light, bicycle head light)
Package Dimension for Moonstone®
10.00
1
Anode
2 Cathode
3
Heat Sink
3.30
8.50
Metal Slug
3
Ø
5.26
10.60
8.50
Ø 8.00
1.27
LED
+
−
ZENER
2.00
1.30
1
5.08
Figure 1. Moonstone® package outline drawing.
2
0.81
5.25
Notes:
1. All dimensions in mm.
2. Tolerance = ±0.10mm unless otherwise specified.
3. Terminal finish: Ag plating.
4. Metal slug is connected to anode.
Package Dimension for Moonstone® on MCPCB
16.00
2.50
1
3
∅
5.00
Anode
Heat
Sink
2 Cathode
60
°
20.00
14.00
∅
3.00
∅
19.00
4.00
R 1.60
3.00
19.00
2.30
1.30
4.60
24.00
Figure 2. MCPCB I package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specified.
1.40
1.60
4.90
3.30
19.90
Figure 3. MCPCB II package outline drawing.
2
Part Numbering System
ASMT-M x
1
x
2
9 –
N x
3
x
4
x
5
x
6
Packaging option
Color Bin Selection
Maximum
- lux
Bin Selection
F
Minimum
- lux
Bin Selection
F
Moonstone®
Type
0
–
Non-diffused
B
–
Diffused
A
–
Non-diffused on MCPCB I
C
–
Diffused on MCPCB I
K
–
Non-diffused on MCPCB II
L
–
Diffused on MCPCB II
Color
W
–
Cool White
Y –
Warm White
Note:
1. Please refer to Page 7 for selection details.
Device Selection Guide (T
j
= 25qC) for Moonstone®
Luminous Flux, Φ
V [1,2]
(lm)
Part Number
ASMT-MW09-NLM00
ASMT-MW09-NMM00
ASMT-MY09-NKM00
ASMT-MY09-NLM00
ASMT-MWB9-NLM00
ASMT-MYB9-NKM00
Cool White
Diffused
Warm White
Diffused
Warm White
Color
Cool White
Min.
73.0
95.0
56.0
73.0
73.0
56.0
Typ.
90.0
100.0
75.0
80.0
87.0
72.0
Max.
124.0
124.0
124.0
124.0
124.0
124.0
Test Current
(mA)
350
350
350
350
350
350
Dice
Technology
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
Electrically
Isolated
Metal Slug
No
No
No
No
No
No
Device Selection Guide (T
j
= 25qC) for Moonstone® on MCPCB
Luminous Flux, Φ
V [1,2]
(lm)
Part Number
ASMT-MWK9-NLM00
ASMT-MYK9-NKM00
Color
Cool White
Warm White
Min.
73.0
56.0
Typ.
90.0
75.0
Max.
124.0
124.0
Test Current
(mA)
350
350
Dice
Technology
InGaN
InGaN
Electrically
Isolated
Metal Slug
No
No
Notes:
1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10 %.
3
Absolute Maximum
Ratings
Parameter
DC Forward Current
[1]
Power Dissipation
LED Junction Temperature
Operating Metal Slug Temperature Range at 350 mA
Operating Metal Slug Temperature Range at
500
mA
Storage Temperature Range
Soldering Temperature
Reverse Voltage
[2]
Notes:
1. Derate linearly based on Figure 11.
2. Not designed for reverse bias operation.
ASMT-Mxx9
500
2100
125
-40 to +110
-40 to +105
-40 to +120
Refer to Figure 14
Not recommended
Units
mA
mW
°C
°C
°C
°C
Optical Characteristics at 350 mA (T
J
= 25 °C)
Correlated Color Temperature,
CCT (Kelvin)
Part Number
ASMT-MW09-NLM00
ASMT-MWK9-NLM00
ASMT-MW09-NMM00
ASMT-MY09-NKM00
ASMT-MY09-NKM00
ASMT-MY09-NLM00
ASMT-MWB9-NLM00
ASMT-MYB9-NKM00
Cool White
Diffused
Warm White
Diffused
Warm White
Viewing Angle,
2T
½ [2]
(°)
Typ.
110
110
110
110
110
110
110
110
Luminous Efficiency
(lm/W)
Typ.
71
71
79
60
60
63
69
57
Color
Cool White
Min.
4000
4000
4000
2600
2600
2600
4000
2600
Max.
10000
10000
10000
4000
4000
4000
1000
4000
Notes:
1.
T½
is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (T
J
= 25°C)
Forward Voltage, V
F
(Volts)
Dice Type
InGaN
Thermal
Resistance,
RT
j-ms
(°C/W)
[1]
Max.
4.0
Thermal
Resistance,
RT
j-b
(°C/W)
[2]
Typ.
14
Min.
3.2
Typ.
3.6
Typ.
10
Notes:
1. RT
j-ms
is the thermal resistance from LED junction to metal slug.
2. RT
j-b
is the thermal resistance from LED junction to MCPCB.
4
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
350
I
F
- FORWARD CURRENT - mA
Cool White
Warm White
400
450
500 550 600 650
WAVELENGTH - nm
700
750
800
500
450
400
350
300
250
200
150
100
50
0
0.0
RELATIVE INTENSITY
0.5
1.0
1.5
2.0
2.5
3.0
V
F
- FORWARD VOLTAGE - V
3.5
4.0
Figure
4. Relative
intensity vs. wavelength
Figure
5.
Forward voltage vs. forward current.
1.4
RELATIVE LUMINOUS FLUX - lm
1.2
RELATIVE INTENSITY
1.0
0.8
0.6
0.4
0.2
0.0
0
50
100 150 200 250 300 350 400 450 500
I
F
- FORWARD CURRENT - mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT - °
60
90
Figure
6. Relative
luminous flux vs. forward current.
Figure 7.
Radiation
pattern.
0.002
0.001
Y - COORDINATES
0.000
-0.001
-0.002
-0.003
-0.004
-0.003
50mA
-0.002
-0.001
0.000
X - COORDINATES
0.001
0.002
350mA
250mA
150mA
500mA
Y - COORDINATES
0.002
0.001
0.000
-0.001
-0.002
-0.003
-0.004
-0.002
50mA
-0.001
0.000
0.001
X - COORDINATES
0.002
0.003
500mA
350mA
250mA
150mA
Figure 8. Chromaticity coordinate shift vs. forward current (Cool White).
Figure 9. Chromaticity coordinate shift vs. forward current (Warm White).
5
Microchip MCU
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