Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, MO-163, BGA-153
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microsemi |
| 零件包装代码 | BGA |
| 包装说明 | BGA, |
| 针数 | 153 |
| Reach Compliance Code | compliant |
| 其他特性 | 128K X 32 SRAM ALSO AVAILABLE |
| JESD-30 代码 | R-PBGA-B153 |
| 长度 | 22 mm |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 153 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX32 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.5 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| EDI9LC644V1512BC | EDI9LC644V1510BC | EDI9LC644V1312BC | EDI9LC644V1610BC | EDI9LC644V2010BC | EDI9LC644V2012BC | EDI9LC644V1310BC | EDI9LC644V1612BC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, MO-163, BGA-153 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, BGA-153 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, MO-163, BGA-153 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, BGA-153 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, BGA-153 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, BGA-153 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, MO-163, BGA-153 | Memory Circuit, 1MX32, CMOS, PBGA153, 14 X 22 MM, MO-163, BGA-153 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
| 针数 | 153 | 153 | 153 | 153 | 153 | 153 | 153 | 153 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | 128K X 32 SRAM ALSO AVAILABLE | 128K X 32 SRAM ALSO AVAILABLE | 128K X 32 SRAM ALSO AVAILABLE | 128K X 32 SRAM ALSO AVAILABLE | 128K X 32 SRAM ALSO AVAILABLE | 128K X 32 SRAM ALSO AVAILABLE | 128K X 32 SRAM ALSO AVAILABLE | 128K X 32 SRAM ALSO AVAILABLE |
| JESD-30 代码 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 |
| 长度 | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
| 内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 153 | 153 | 153 | 153 | 153 | 153 | 153 | 153 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
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