Flash, 256KX8, 80ns, PDSO32, 0.310 X 0.720 INCH, TSOP-32
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Intel(英特尔) |
| 零件包装代码 | TSOP |
| 包装说明 | 0.310 X 0.720 INCH, TSOP-32 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 80 ns |
| 其他特性 | 100000 ERASE/PROGRAM CYCLES |
| 命令用户界面 | YES |
| 数据轮询 | NO |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G32 |
| JESD-609代码 | e0 |
| 长度 | 18.4 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装等效代码 | TSSOP32,.8,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 编程电压 | 12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 切换位 | NO |
| 类型 | NOR TYPE |
| 宽度 | 8 mm |
| E28F020-70 | F28F020-90 | TF28F020-90 | F28F020-70 | N28F020-70 | P28F020-70 | |
|---|---|---|---|---|---|---|
| 描述 | Flash, 256KX8, 80ns, PDSO32, 0.310 X 0.720 INCH, TSOP-32 | Flash, 256KX8, 90ns, PDSO32, 8 X 20 MM, REVERSE, TSOP-32 | Flash, 256KX8, 90ns, PDSO32, 8 X 20 MM, REVERSE, TSOP-32 | Flash, 256KX8, 80ns, PDSO32, 8 X 20 MM, REVERSE, TSOP-32 | Flash, 256KX8, 80ns, PQCC32, 0.450 X 0.550 INCH, PLASTIC, LCC-32 | Flash, 256KX8, 80ns, PDIP32, 0.620 X 1.640 INCH, PLASTIC, DIP-32 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TSOP | TSOP | TSOP | TSOP | QFJ | DIP |
| 包装说明 | 0.310 X 0.720 INCH, TSOP-32 | TSOP1-R, TSSOP32,.8,20 | TSOP1-R, TSSOP32,.8,20 | TSOP1-R, TSSOP32,.8,20 | QCCJ, LDCC32,.5X.6 | DIP, DIP32,.6 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 80 ns | 90 ns | 90 ns | 80 ns | 80 ns | 80 ns |
| 其他特性 | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES | 100000 ERASE/PROGRAM CYCLES |
| 命令用户界面 | YES | YES | YES | YES | YES | YES |
| 数据轮询 | NO | NO | NO | NO | NO | NO |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PDIP-T32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 13.97 mm | 41.91 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | TSOP1-R | TSOP1-R | TSOP1-R | QCCJ | DIP |
| 封装等效代码 | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 | LDCC32,.5X.6 | DIP32,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.56 mm | 4.83 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | THROUGH-HOLE |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| 切换位 | NO | NO | NO | NO | NO | NO |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 11.43 mm | 15.24 mm |
| 厂商名称 | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | - | Intel(英特尔) | Intel(英特尔) |
微控制器 MCU
模拟电子
stm32/stm8
FPGA/CPLD
嵌入式系统
汽车电子
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