TECHNICAL NOTE
Automotive Body Power Management LSI
LDO
Regulator
BD357XFP/HFP SERIES
TENTATIVE
ROHM CO.,LTD
DESIGN
INFORMATION
Description
BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle
microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30μA (TYP).With these
devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within
±2%
over the
wide ambient temperature range (-40 to 125℃), and the short circuit protection is folded-type to minimize generation of heat
during malfunction. These devices are developed to offer most robust power-supply design under the harsh automotive
environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to simplify the
use with battery direct-coupled systems.
Features
1) Ultra-low quiescent current: 30μA (TYP.)
2) Low-saturation voltage type P-channel DMOS output transistors
3) High output voltage precision:
±
2%／Iomax = 500 mA
4) Low-ESR ceramic capacitors can be used as output capacitors.
5) Vcc power supply voltage = 50 V
6) Built-in overcurrent protection circuit and thermal shutdown circuit
7) TO252-3,5／HRP-5 Package
Applications
・Onboard
vehicle devices (body-control, car stereos, satellite navigation systems, etc.)
Product line
BD3570FP/HFP
Output voltage
SW function
Package
3.3V
－
FP:TO252-3,TO252-5
HFP:HRP5
BD3571FP/HFP
5.0 V
－
BD3572FP/HFP
Variable
－
BD3573FP/HFP
3.3V
〇
BD3574FP/HFP
5.0 V
〇
BD3575FP/HFP
Variable
〇
Absolute maximum ratings (T
a
=25°C)
Parameter
Supply voltage
Switch Supply voltage
Output current
Power dissipation
Operating temperature range
Storage temperature range
Maximum junction temperature
※1
※2
※3
※4
※5
Symbol
V
CC
V
SW
I
O
Pd
T
opr
T
stg
T
jmax
Limit
50
50
500
1.2 (TO252-3)
※3
1.3 (TO252-5)
※4
1.6 (HRP5)
-40 to +125
-55 to +150
150
※5
°C
°C
°C
W
※1
※2
Unit
V
V
mA
Not to exceed Pd and ASO.
for ON/OFF SW Regulator only
TO252-3: Reduced by 9.6 mW/°C over 25 °C, when mounted on a glass epoxy board (70 mm
×
70 mm
×
1.6 mm).
TO252-5: Reduced by 10.4 mW/°C over 25 °C, when mounted on a glass epoxy board (70 mm
×
70 mm
×
1.6 mm).
HRP-5: Reduced by 12.8 mW/°C over 25 °C, when mounted on a glass epoxy board (70 mm
×
70 mm
×
1.6 mm).
2007. Sep.
TENTATIVE
ROHM CO.,LTD
Operating Conditions
Parameter
Input voltage
BD3570,3572,3573,3575FP/HFP
BD3571,3574FP/HFP
Output current
Variable Output Voltage Range
Symbol
V
CC
V
CC
I
O
V
O
Min.
4.5
※6
5.5
※6
－
2.8
Max.
36.0
36.0
500
12
Unit
V
V
mA
V
※6
Please consider that the Output voltage would be dropped (Dropout voltage) according to the output current.
Electrical Characteristics（Unless otherwise specified, T
a
=-40 to125°C, V
CC
=13.2 V, SW=3V
※7,
V
O
settings is 5V
※8）
Parameter
Shut Down Current
Bias current
Output voltage
ADJ Terminal voltage
Output current
Dropout voltage
Ripple rejection
Line Regulation
Load Regulation
Swith Threshold voltage H
Swith Threshold voltage L
Swith Bias current
※7
※8
※9
※10
※７
※７
※７
※8
※７
Symbol
lshut
lb
V
O
VADJ
I
O
△Vd
R.R.
Reg.I
Reg.L
SWH
SWL
SWI
Limit
Min.
－
－
V
O
×
0.98
1.235
0.5
－
45
－
－
2.0
－
－
Typ.
－
30
V
O
1.260
－
0.25
55
10
20
－
－
22
Max.
10
50
V
O
×
1.02
1.285
－
0.48
－
30
40
－
0.5
60
Unit
μA
μA
V
V
A
V
dB
mV
mV
V
V
μA
V
CC
=4.75V,l
O
=200mA
※9
SW=GND
I
O
=0mA
I
O
=200mA,
V
O
:Please refer to Product line.
I
O
=200mA
Conditions
f=120Hz,ein=1V
rms
,I
O
=100mA
V
CCD
※10≦V
CC
≦25V
I
O
= 0 mA
0½A≦I
O
≦200½A
I
O
=0 mA
I
O
=0 mA
SW=5V,l
O
=0mA
BD3573,3574,3575FP/HFP only
BD3572,3575FP/HFP only
BD3571,3572,3574,3575FP/HFP only
BD3570,3573FP/HFP :V
CCD
=5.5V
BD3571,3572,3574,3575FP/HFP :V
CCD
=6.5V
2/8
TENTATIVE
ROHM CO.,LTD
Reference Data: BD3574HFP（Unless otherwise specified, T
a
=25°C）
50
CIRCUIT CURRENT: I
CC
[
μ
A]
6
5
4
3
6
5
4
T
a
=-40
℃
3
2
1
0
0
5
10
15
20
25
OUTPUT VOLTAGE: V
O
[V]
30
20
T
a
=125℃
T
a
=25℃
T
a
=125
℃
2
OUTPUT VOLTAGE: V
O
[V]
40
T
a
=25
℃
T
a
=25
℃
1
0
10
T
a
=-40℃
0
0
5
10
15
20
25
SUPPLY VOLTAGE: V
DD
[V]
T
a
=-40
℃
T
a
=125
℃
0
500
1000
1500
2000
SUPPLY VOLTAGE: V
CC
[V]
OUTPUT CURRENT: I
O
[mA]
Fig. 1 Total Supply Current
Fig. 2 Output Voltage VS
Power Supply Voltage
70
Fig. 3 Output Voltage VS Load
3
6
RIPPLE REJECTION:R.R. [dB]
DROPOUT VOLTAGE:
Δ
Vd[V]
60
50
40
30
20
10
0
T
a
=125
℃
T
a
=25
℃
OUTPUT VOLTAGE: V
O
[V]
5
4
2
T
a
=25℃
T
a
=125℃
T
a
=125
℃
T
a
=25
℃
1
T
a
=-40
℃
3
2
T
a
=-40
℃
T
a
=-40℃
1
0
0
0
100
200
300
400
500
OUTPUT CURRENT: I
O
[mA]
10
100
1000
10000
100000 1000000
0
0.5
1
1.5
2
FREQUENCY: f [Hz]
SUPPLY VOLTAGE: V
SW
[V]
Fig. 4 Dropout Voltage
Fig. 5 Ripple rejection
Fig. 6 Output Voltage VS
SW Input Voltage
5.5
100
CIRCUIT CURRENT: I
CC
[
μ
A]
6
5
4
3
2
1
0
100
80
OUTPUT VOLTAGE: V
O
[V]
OUTPUT VOLTAGE: V
O
[V]
5.25
60
5
40
4.75
20
0
0
100
200
300
400
500
OUTPUT CURRENT: I
O
[mA]
120
140
160
180
200
4.5
-40
0
40
80
120
AMBIENT TEMPERATURE: T
a
[
℃
]
AMBIENT TEMPERATURE: T
a
[
℃
]
Fig. 7 Total Supply Current
Classified by Load
120
DROPOUT VOLTAGE:
Δ
Vd [V]
Fig. 8 Thermal Shutdown Circuit
Fig. 9 Output Voltage VS
Temperature
50
CIRCUIT CURRENT: I
cc
[
μ
A]
2
SW BIAS CURRENT: I
SW
[
μ
A]
40
90
T
a
=125
℃
60
1.5
30
1
20
T
a
=25
℃
30
T
a
=-40
℃
0
0
5
10
15
20
25
SUPPLY VOLTAGE: V
SW
[V]
0.5
10
0
-40
0
40
80
120
0
-40
0
40
80
120
AMBIENT TEMPERATURE: T
a
[
℃
]
AMBIENT TEMPERATURE: T
a
[
℃
]
Fig. 10 SW Bias current
Fig. 11 Dropout voltage VS
Temperature
3/8
Fig. 12 Total Supply Current
Temperature
TENTATIVE
ROHM CO.,LTD
Block Diagram
Vcc
1
Cin
Vref
Vo
3
OCP
Co
OCP
＊1）
Cin
SW
2
5
Co
OCP
＊1）
＊2）
3
TSD
4
＊
1)
Vcc
1
Vcc
1
Cin
Vref
Vo
SW
2
5
Co
Vref
Vo
GND
TSD
Fin
2
N.C.
GND
TSD
Fin
3
N.C.
4
＊2）
GND
Fin
ADJ (N.C.
)
ADJ (N.C.
＊
1)
)
Fig.13 TO252-3
Fig.14 TO252-5
Cin 0.33μF½1000μF
：
Fig.15 HRP-5
＊1）For
Fixed Voltage Regulator only
＊2）For
adjustable Voltage Regulator only
Vcc
Co：0.1μF½1000μF
I/O Cirouit diagram (All resistance values are typical.)
Vcc
Vo
SW
210K
1K
Vo
200K
1992K: BD3570, BD3573
3706K: BD3571, BD3574
150
1250K
Fig.16 2PIN[SW]
Fig.17 5PIN[V
O
]
BD3570,3571,3573,3574
Fig.18 4.5PIN[ADJ,V
O
]
BD3572,BD3575
Pin Assignments
FIN
•TO252-3
Pin No.
1
2
3
1 2 3
Fig. 19
Pin No.
1
•TO252-5
2
3
1 2345
Fig.20
4
5
Fin
Pin name
V
CC
SW
N.C.
N.C.
N.C.
ADJ
V
O
GND
Function
Power supply pin
V
O
ON/OFF function pin
N.C. pin(BD3572FP only)
N.C. pin
N.C. pin
Output voltage setting pin(BD3572,3575FP only)
Voltage output pin
GND pin
Fin
Pin name
V
CC
N.C.
V
O
GND
N.C. pin
Voltage output pin
GND pin
Function
Power supply pin
FIN
Pin No.
FIN
•HRP-5
1
2
3
1 23 45
Fig. 21
4
5
Fin
Pin name
V
CC
SW
N.C.
GND
N.C.
ADJ
V
O
GND
Function
Power supply pin
V
O
ON/OFF function pin (BD3573,3574,3575HFP only)
N.C. pin
GND pin
N.C. pin
Output voltage setting pin(BD3572,3575HFP only)
Voltage output pin
GND pin
4/8
TENTATIVE
ROHM CO.,LTD
Output Voltage Adjustment
Vo
R2
To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins,
and pull-up resistor R2 between the V
O
and ADJ pins.
Vo = VADJ×(R1+R2) / R1 [V]
½VADJ=1.26V(TYP.)½
The recommerided connection resistor for the ADJ-GND is 30k½150kΩ.
ADJ
R1
Fig.22
Setting of Heat
TO252-3
2.0
IC mounted on a ROHM standard board
Substrate size: 70 mm
×
70 mm
×
1.6 mm
θja
= 104.2 (°C/W)
TO252-5
2.0
IC mounted on a ROHM standard board
Substrate size: 70 mm
×
70 mm
×
1.6 mm
θja
= 96.2 (°C/W)
HRP-5
2.0
1.6 W
IC mounted on a ROHM standard board
Substrate size: 70 mm
×
70 mm
×
1.6 mm
θja
= 78.1 (°C/W)
POWER DISSIPATION: Pd [W]
POWER DISSIPATION: Pd [W]
1.2 W
1.2
1.3W
1.2
POWER DISSIPATION: Pd [W]
1.6
1.6
1.6
1.2
0.8
0.8
0.8
0.4
0.4
0.4
0
0
25
50
75
100
125
150
0
0
25
50
75
100
125
150
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: T
a
[°C]
AMBIENT TEMPERATURE: T
a
[
℃
]
AMBIENT TEMPERATURE: T
a
[°C]
Fig. 23
Fig. 24
Fig. 25
Refer to the heat mitigation characteristics illustrated in Figs. 17 and 18 when using the IC in an environment where T
a
≧25°C.
The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of the maximum
junction temperature T
jmax
, the elements of the IC may be deteriorated or damaged. It is necessary to give sufficient
consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the
maintenance of the reliability of the IC in long-time operation.
In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction
temperature T
jmax
. Fig. 17 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate the IC
within the power dissipation Pd. The following method is used to calculate the power consumption P
C
(W).
Vcc : Input voltage
Vo : Output voltage
Io : Load current
Icc : Total supply current
P
C
=(V
CC
-V
O
)×I
O
+V
CC
×I
CC
Power dissipation Pd≦P
C
The load current I
O
is obtained to operate the IC within the power dissipation.
Pd-V
CC
×I
CC
Io≦
V
CC
-V
O
(For more information about I
CC
, see page 12.)
The maximum load current I
omax
for the applied voltage V
CC
can be calculated during the thermal design process.
•Calculation
example
Example: BD3571FP V
CC
= 12 V and V
O
= 5 V at T
a
= 85°C
I
O
≦
0.624-12×I
CC
θ
ja
=104.2℃/W→-9.6mAW/℃
25℃=1.2W→85℃=0.624W
12-5
I
O
≦
89mA
(I
CC
=30μA)
Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the power
dissipation.
The power consumption Pc of the IC in the event of shorting (i.e., if the V
O
and GND pins are shorted) will be obtained from the
following equation.
Pc=V
CC
×(I
CC
+Ishort)
Ishort = Short current
5/8
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