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PLAD30KP160

产品描述Trans Voltage Suppressor Diode, 30000W, 160V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1
产品类别分立半导体    二极管   
文件大小269KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
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PLAD30KP160概述

Trans Voltage Suppressor Diode, 30000W, 160V V(RWM), Unidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1

PLAD30KP160规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Microsemi
包装说明PLASTIC PACKAGE-1
针数1
Reach Compliance Codeunknown
ECCN代码EAR99
最大击穿电压218 V
最小击穿电压178 V
击穿电压标称值198 V
最大钳位电压287 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码S-PSSO-G1
JESD-609代码e0
最大非重复峰值反向功率耗散30000 W
元件数量1
端子数量1
封装主体材料PLASTIC/EPOXY
封装形状SQUARE
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散2.5 W
认证状态Not Qualified
最大重复峰值反向电压160 V
表面贴装YES
技术AVALANCHE
端子面层TIN LEAD
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间NOT SPECIFIED

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PLAD30KP10 thru PLAD30KP400CA, e3
30kW Surface Mount Transient
Voltage Suppressor
SCOTTSDALE DIVISION
DESCRIPTION
These Microsemi 30 kW Transient Voltage Suppressors (TVSs)
are designed for applications requiring protection of voltage-
sensitive electronic devices that may be damaged by harsh or
severe voltage transients including lightning per IEC61000-4-5
and class levels with various source impedances described
herein. This series is available in 10 to 400 volt Standoff
Voltages (V
WM
) in both unidirectional and bi-directional with either
5% or 10% tolerances of the Breakdown Voltage (V
BR
).
Microsemi also offers numerous other TVS products to meet
higher or lower power demands and special applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
FEATURES
Available in both Unidirectional and Bidirectional
construction (Bidirectional with C or CA suffix)
Selections for 10 to 400 volt Standoff Voltages V
WM
Suppresses transients up to 30 kW @ 10/1000 µs and 200
kW @ 8/20 µs (see Figure 1)
Fast response
Optional 100%
screening for avionics grade
is available
by adding MA prefix to part number for added 100%
temperature cycle -55
o
C to +125
o
C (10X) as well as surge
(3X) and 24 hours HTRB with post test V
Z
& I
R
(in the
operating direction for unidirectional or both directions for
bidirectional)
Options for screening in accordance with MIL-PRF-19500
for JAN, JANTX, and JANTXV are available by adding MQ,
MX, or MV prefixes respectively to part numbers.
Moisture classification is Level 1 with no dry pack required
per IPC/JEDEC J-STD-020B
RoHS Compliant devices available by adding an “e3” suffix
APPLICATIONS / BENEFITS
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and
IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1,2,3,4: PLAD30KP10 - PLAD30KP400A or CA
Class 5: PLAD30KP10 - PLAD30KP400A or CA (short
distance)
Class 5: PLAD30KP10 - PLAD30KP220A or CA (long
distance)
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1,2, 3: PLAD30KP10 to PLAD30KP400A or CA
Class 4: PLAD30KP10 to PLAD30KP220A or CA
Secondary lightning protection per IEC61000-4-5 with 2
Ohms source impedance:
Class 2: PLAD30KP10 to PLAD30KP400A or CA
Class 3: PLAD30KP10 to PLAD30KP220A or CA
Class 4: PLAD30KP10 to PLAD30KP110A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 30,000 watts at
10/1000
μs
(also see Figures 1 and 2)
Impulse repetition rate (duty factor): 0.05%
t
clamping
(0 volts to V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating & Storage temperature: -65
º
C to +150
º
C
Thermal resistance: 0.5
º
C/W junction to case, or 50
º
C/W
junction to ambient when mounted on FR4 PC board with
recommended mounting pad with 1 oz Cu (see last page)
Steady-State Power dissipation: 250 watts at T
c
= 25
o
C,
or 2.5 watts at T
A
= 25
º
C when mounted on FR4 PC
board as described for thermal resistance above
Forward Surge: 1500 Amps (theoretical) at 8.3 ms half-
sine wave for unidirectional devices only
Solder temperatures: 260
º
C for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
FINISH: Tin-Lead or RoHS Compliant annealed
matte-Tin plating readily solderable per MIL-
STD-750, method 2026
MARKING: Body marked with part number
POLARITY: For unidirectional devices, the
cathode is on the metal backside (package
bottom)
WEIGHT: 1.7-2.0 grams (approximate)
TAPE & REEL option: Standard per EIA-296
for axial package (add “TR” suffix to part
number)
See package dimension on last page
PLAD30KP10 thru 400CA, e3
Copyright
©
2007
9-12-2007 Rev G
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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