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HB56G51232B-7CL

产品描述Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72
产品类别存储    存储   
文件大小77KB,共7页
制造商Hitachi (Renesas )
官网地址http://www.renesas.com/eng/
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HB56G51232B-7CL概述

Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72

HB56G51232B-7CL规格参数

参数名称属性值
厂商名称Hitachi (Renesas )
零件包装代码SIMM
包装说明SIMM, SSIM72
针数72
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式FAST PAGE
最长访问时间70 ns
其他特性RAS ONLY/CAS BEFORE RAS REFRESH
I/O 类型COMMON
JESD-30 代码R-XSMA-N72
内存密度16777216 bit
内存集成电路类型FAST PAGE DRAM MODULE
内存宽度32
功能数量1
端口数量1
端子数量72
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX32
输出特性3-STATE
封装主体材料UNSPECIFIED
封装代码SIMM
封装等效代码SSIM72
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
电源5 V
认证状态Not Qualified
刷新周期512
座面最大高度20.32 mm
自我刷新NO
最大待机电流0.0008 A
最大压摆率0.29 mA
最大供电电压 (Vsup)5.25 V
最小供电电压 (Vsup)4.75 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术MOS
温度等级COMMERCIAL
端子形式NO LEAD
端子节距1.27 mm
端子位置SINGLE

文档预览

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HB56G51232 Series
524,288-word
×
32-bit High Density Dynamic RAM Module
ADE-203-
Rev. 0.0
Dec. 1, 1995
Description
The HB56G51232B/SB is a 512 k
×
32 dynamic RAM module, mounted 4 pieces of 4-Mbit DRAM
(HM514260CJ/CLJ) sealed in SOJ package. An outline of the HB56G51232B/SB is 72-pin single in-line
package. Therefore, the HB56G51232B/SB makes high density mounting possible without surface mount
technology. The HB56G51232B/SB provides common data inputs and outputs. Decoupling capacitors are
mounted beside each SOJ.
Features
72-pin single in-line package
– Lead pitch: 1.27 mm
Single 5 V (± 5%) supply
High speed
– Access time: 70 ns/80 ns (max)
Low power dissipation
– Active mode: 1.6 W/1.4 W (max)
– Standby mode: 42 mW (max)
4.2 mW (max) (L version)
Fast page mode capability
512 refresh cycle: 8 ms
128 ms (L-version)
2 variations of refresh
RAS-only
refresh
CAS-before-RAS
refresh
TTL compatible

HB56G51232B-7CL相似产品对比

HB56G51232B-7CL HB56G51232SB-8C HB56G51232B-8C HB56G51232SB-7CL HB56G51232B-7C HB56G51232B-8CL HB56G51232SB-7C HB56G51232SB-8CL
描述 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 70ns, MOS, SIMM-72 Fast Page DRAM Module, 512KX32, 80ns, MOS, SIMM-72
厂商名称 Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
零件包装代码 SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
包装说明 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72
针数 72 72 72 72 72 72 72 72
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 70 ns 80 ns 80 ns 70 ns 70 ns 80 ns 70 ns 80 ns
其他特性 RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bi 16777216 bi
内存集成电路类型 FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
内存宽度 32 32 32 32 32 32 32 32
功能数量 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1
端子数量 72 72 72 72 72 72 72 72
字数 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
封装等效代码 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 512 512 512 512 512 512 512 512
座面最大高度 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm 20.32 mm
自我刷新 NO NO NO NO NO NO NO NO
最大待机电流 0.0008 A 0.004 A 0.004 A 0.0008 A 0.004 A 0.0008 A 0.004 A 0.0008 A
最大压摆率 0.29 mA 0.26 mA 0.26 mA 0.29 mA 0.29 mA 0.26 mA 0.29 mA 0.26 mA
最大供电电压 (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
最小供电电压 (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO
技术 MOS MOS MOS MOS MOS MOS MOS MOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE

 
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