Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25AEC
Rev. 8, 01/2011
i.MX25 Applications
Processor for Automotive
Products
Silicon Version 1.2
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
1
Introduction
Ordering Information
See
Table 1 on page 3
for ordering information.
The i.MX25 family of processors offers integration
that tailors itself to the connectivity requirements of
today's automobile infotainment systems. These
processors have been architected to meet auto
infotainment requirements like CAN, USB
connectivity, and audio connectivity, without many
of the extra features only needed for high-end
applications. As a result, the i.MX25 enables many
of the features only available in high-end systems,
but at a price point suitable for all vehicles.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM926EJ-S core, with speeds of up to 400 MHz.
The i.MX25 includes support for up to 133-MHz
DDR2 memory, integrated 10/100 Ethernet MAC,
and two on-chip USB PHYs. The automotive
versions of the i.MX25 offer AEC-Q100 grade 3
qualification to meet stringent automotive quality
requirements. The device is suitable for a wide
range of applications, including the following:
• USB Connectivity for media
storage/playback, personal media device
interface, and firmware updates
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 25
3.7. Module Timing and Electrical Parameters . . . . . . 42
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
© Freescale Semiconductor, Inc., 2011. All rights reserved.
•
•
•
•
Bluetooth™ connectivity for hands free phone calling and streaming audio from wireless devices
like phones or PND
Control of the infotainment system through basic speech recognition or touch screen
Smart toll and metering applications
Secure data black box applications
Features of the i.MX25 processor include the following:
• Advanced power management—The heart of the device is a level of power management
throughout the IC that enables the multimedia features and peripherals to achieve minimum system
power consumption in active and various low-power modes. Power management techniques allow
the designer to deliver a feature-rich product that requires levels of power far lower than typical
industry expectations.
• Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a
16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with
alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen
controller), and a programmable Smart DMA (SDMA) controller.
• 128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for
eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows
the designer to enable an ultra low power LCD refresh.
• Interface flexibility—The device interface supports connection to all common types of external
memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,
and managed NAND.
• Increased security—Because the need for advanced security for tethered and untethered devices
continues to increase, the i.MX25 processor delivers hardware-enabled security features that
enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust
tamper detection, secure boot, and secure software downloads.
• On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.
• Fast Ethernet—For rapid external communication, a Fast Ethernet Controller (FEC) is included.
• i.MX25 only supports Little Endian mode.
i.MX25 Applications Processor for Automotive Products, Rev. 8
2
Freescale Semiconductor
1.1
Ordering Information
Table 1. Ordering Information
1
Table 1
provides ordering information for the i.MX25.
Description
i.MX251
i.MX255
i.MX251
i.MX255
i.MX251
i.MX255
1
Part Number
MCIMX251AVM4!
MCIMX255AVM4!
MCIMX251AJM4
MCIMX255AJM4
MCIMX251AJM4A
MCIMX255AJM4A
Silicon
Version
1.1
1.1
1.1
1.1
1.2
1.2
Projected
Temperature
Range (°C)
–40 to +85
–40 to +85
–40 to +85
–40 to +85
–40 to +85
–40 to +85
Package
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
17 x 17 mm, 0.8 mm pitch,
MAPBGA-400
Ballmap
Table 103
Table 103
Table 103
Table 103
Table 103
Table 103
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:
Indicated by the Icon (!)
Table 2
shows the functional differences between the different parts in the i.MX25 family.
Table 2. i.MX25 Parts Functional Differences
Features
Core
CPU Speed
L1 I/D Cache
On-chip SRAM
PATA/CE-ATA
LCD Controller
Touchscreen
CSI
FlexCAN (2)
ESAI
SIM (2)
Security
10/100 Ethernet
HS USB 2.0 OTG + PHY
HS USB 2.0 Host + PHY
MCIMX251
ARM926EJ-S™
400 MHz
16K I/D
128 KB
—
—
—
—
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX255
ARM926EJ-S™
400MHz
16K I/D
128 KB
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
i.MX25 Applications Processor for Automotive Products, Rev. 8
Freescale Semiconductor
3
Table 2. i.MX25 Parts Functional Differences (continued)
Features
12-bit ADC
SD/SDIO/MMC (2)
External Memory Controller
I
2
C (3)
SSI/I2S (2)
CSPI (2)
UART (5)
MCIMX251
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MCIMX255
Yes
Yes
Yes
Yes
Yes
Yes
Yes
i.MX25 Applications Processor for Automotive Products, Rev. 8
4
Freescale Semiconductor
1.2
Block Diagram
DDR2 /
MDDR
NOR
Flash/
PSRAM
NAND
Flash
Ext. Graphics
Accelerator
Camera
Sensor
LCD Display 1
Figure 1
shows the simplified interface block diagram.
ARM® Processor Domain (AP)
External Memory
Interface (EMI)
CSI
LCDC /
SLCDC
Smart
DMA
ARM9
Platform
ARM926EJ-S
L1 I/D cache
ARM Peripherals
SSI
AUDMUX
I C(3)
2
HS USBOTG
HS USB OT GPHY
Shared
Domain
SPBA
HS USB Host
FS USB Host PHY
SDMA Peripherals
AVIC
MAX
AIPS (2)
ETM
UART(2)
CSPI
eSDHC(2)
FlexCAN(2)
ECT
IOMUX
IIM
RTICv3
RNGB
SCC
DRYICE
KPP
PWM(4)
Timers
RTC
WDOG
GPT(4)
GPIO(3)
EPIT(2)
SSI(1)
ESAI
UART(3)
CSPI(2)
ADC/TSC
SIM(2)
ATA
FEC
Internal
Memory
Fusebox
1-WIRE
Audio/Power
Management
JTAG
Bluetooth
MMC/SDIO
or WLAN
Keypad
Access.
Conn.
Figure 1. i.MX25 Simplified Interface Block Diagram
i.MX25 Applications Processor for Automotive Products, Rev. 8
Freescale Semiconductor
5
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