Standard SRAM, 8KX8, 10ns, CMOS, PDSO28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | LSC/CSI |
包装说明 | SOJ, SOJ28,.34 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 10 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-J28 |
JESD-609代码 | e0 |
内存密度 | 65536 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 28 |
字数 | 8192 words |
字数代码 | 8000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 8KX8 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装等效代码 | SOJ28,.34 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.00025 A |
最小待机电流 | 2 V |
最大压摆率 | 0.3 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
ATT7C185J-10 | ATT7C185P-25 | ATT7C185P-20 | ATT7C185J-12 | ATT7C185J-15 | ATT7C185J-20 | ATT7C185J-25 | ATT7C185P-10 | ATT7C185P-12 | ATT7C185P-15 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 8KX8, 10ns, CMOS, PDSO28 | Standard SRAM, 8KX8, 25ns, CMOS, PDIP28 | Standard SRAM, 8KX8, 20ns, CMOS, PDIP28 | Standard SRAM, 8KX8, 12ns, CMOS, PDSO28 | Standard SRAM, 8KX8, 15ns, CMOS, PDSO28 | Standard SRAM, 8KX8, 20ns, CMOS, PDSO28 | Standard SRAM, 8KX8, 25ns, CMOS, PDSO28 | Standard SRAM, 8KX8, 10ns, CMOS, PDIP28 | Standard SRAM, 8KX8, 12ns, CMOS, PDIP28 | Standard SRAM, 8KX8, 15ns, CMOS, PDIP28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI | LSC/CSI |
包装说明 | SOJ, SOJ28,.34 | DIP, DIP28,.3 | DIP, DIP28,.3 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 10 ns | 25 ns | 20 ns | 12 ns | 15 ns | 20 ns | 25 ns | 10 ns | 12 ns | 15 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-J28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | DIP | DIP | SOJ | SOJ | SOJ | SOJ | DIP | DIP | DIP |
封装等效代码 | SOJ28,.34 | DIP28,.3 | DIP28,.3 | SOJ28,.34 | SOJ28,.34 | SOJ28,.34 | SOJ28,.34 | DIP28,.3 | DIP28,.3 | DIP28,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最大压摆率 | 0.3 mA | 0.15 mA | 0.185 mA | 0.275 mA | 0.24 mA | 0.185 mA | 0.15 mA | 0.3 mA | 0.275 mA | 0.24 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES | YES | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
功能数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
端口数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
可输出 | YES | - | YES | YES | YES | - | YES | YES | YES | - |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - |
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