DUAL-SOCKET
GPGPU
PLATFORM
S7055AGM3NR / S7055WGM3NR / S7055WAGM3NR /
S7055AGM3NR-2T(BTO)
S7055
High-end dual-socket server platform for
HPC and GPU applications
Dual LGA2011 socket supports (2) E5-2600/E5-2600 v2 Series CPU
Intel® C602 PCH and INTEL SAS ROM key design
(4+4) 240-pin UDIMM/RDIMM/LRDIMM ECC 1066/1333/1600/1866
*Speed 1866 only for 1 slot per channel 1.5V(Blue color DIMM slot )
Support up to 128GB RDIMM/64GB URDIMM memory
(4) PCI-E Gen3 x16 slots
(1) PCI-E Gen2 x8 slots
(4) SATA-II connectors w/ RAID 0, 1, 10, 5 support
(2) SATA-III connectors
(2) 10GbE Base-T Capability (S7055AGM3NR-2T)
◆
up to (3) GbE LAN
◆
SSI EEB (12" x 13") form factor
Intel
®
C602 Chipset
Specifications are subject to change without notice. Items pictured may only be representative.
S7055
Processor
Socket Type / Q'ty
S7055AGM3NR / S7055WGM3NR / S7055WAGM3NR /
S7055AGM3NR-2T(BTO)
Specifications
Block
Diagram
DDR3
channel A
Supported CPU Series
Intel Xeon Processor E5-2600/E5-2600 v2 Series
LGA2011 / (2)
Thermal Design Power
150W
(TDP) wattage
PCH / PCI-E Switch
Supported DIMM Qty
DIMM Type / Speed
Intel
®
C602 series
-W sku include INTEL ROM 5 key
(4+4) DIMM sockets
UDIMM/RDIMM/LRDIMM ECC 1066/1333/1600/1866
*Speed 1866 only for 1 slot per channel 1.5V(Blue color
DIMM slot )
Chipset
DDR3
channel B
DDR3
channel C
IVY
Bridge-EP
QPI Port 0
(8.0GT/s)
IVY
Bridge-EP
DDR3
channel A
DDR3
channel B
DDR3
channel C
QPI Port 1
(8.0GT/s)
DDR3
channel D
DDR3
channel D
DMI2 x4
Memory
CPU 1
PCI Express x16
PCI Express x16
PCI Express x16
x16 #5
x16 #7
x8 #8
PCIE Gen3 x16
PCIE Gen3 x16
PCIE Gen3 x8
DMI2 x4
CPU 0
x16 #1
x16 #1
PCIE Gen3 x16
PCIE Gen3 x16
PCIE Gen2 x4
Capacity
Memory channel
Memory voltage
PCI-E
up to 128GB UDIMM / 64GB RDIMM
4 Channels per CPU
1.35V/1.5V
(4) PCI-E Gen3 x16 slots (slot #7, #5, #3, #1)
(1) PCI-E Gen2 x8 slots (slot #4)
PCI Express x16
PCI Express x16
I350/X540
RJ45 x2
PCIE Gen3 x4
X
NC
DMI2 uplink
PCI Express x8
PCI 32/33 Slot
x4 #4
#2
PCIE Gen3 x4
PCI 32/33
PCIE Gen2 x1
LPC/USB2.0
AST2300
VGA
Expansion
Slots
Recommended TYAN
®
-
Riser Card
PCI
Port Q'ty
(1) PCI 32-bit slot (slot #2)
(3) GbE ports
Intel
®
82574L / Intel
®
I350-BT2 (S7055AGM3NR /
S7055WGM3NR / S7055WAGM3NR)
Intel
®
82574 / Intel
®
X540AT2 (S7055AGM3NR-2T)
mini SAS Connector x2
ALC262 Audio
USB 2.0 x12
SATA3.0 x2 + SATA2.0 x4
Patsburg
A/D
NCSI Interface
PCIE Gen2 x1
Intel 82574
RJ45
LAN
Controller
Connector
SAS
(opt.)
Controller
Speed
RAID
Connector
SATA
Controller
Speed
RAID
Connector type
(2) Mini-SAS connectors (totally support 8
ports)
Intel C602 with TRK-5 upgrade ROM module
®
Onboard Chipset
Onboard Aspeed AST2300
3.0 Gb/s
RAID 0/1/10
(6) SATA
Intel
®
C602
(2) 6.0 Gb/s(blue color), (4) for 3.0
Gb/s(black color)
RAID 0/1/10/5 (Intel
®
RST)
D-Sub 15-pin
-
Aspeed AST2300
ALC261(S7055AGM3NR SKU)
-
(11) USB2.0 ports (4 at rear, 6 via cable, 3
type A onboard)
(1) DB-9 COM connctor (at rear, COM1) +
(1) Header (COM2)
Line-in, Line out, MIC-in
(1) D-Sub 15-pin VGA port
-
-
SSI 24-pin + 8-pin + 4-pin power connectors
(3) GbE ports
SSI/ATX 24-pin + 8-pin + 8-pin power
connectors
(1) 2x12-pin SSI front panel header
(4) SATA-II, (2) SATA-III connectors
Monitors voltage for CPU, memory, chipset &
power supply
Total (7) 4-pin headers
Monitors temperature for CPU & system
environment
Storage
Server
Management
IPMI 2.0 compliant baseboard management
controller (BMC)
AST2300 IPMI Feature
Supports storage over IP and remote
platform-flash
USB 2.0 virtual hub
AST2300 iKVM Feature
24-bit high quality video compression
10/100 Mb/s MAC interface
AMI / 8MB
Plug and Play (PnP) /PCI2.3 /WfM2.0
/SMBIOS2.3 /PXE boot / ACPI 2.0 power
management /Power on mode after power
recovery / User-configurable H/W monitoring
/ Auto-configurable of hard disk types
SSI EEB
12"x13" (305x330mm)
Please refer to our OS supported list.
Class B
Yes
10° C ~ 35° C (50° F~ 95° F)
- 40° C ~ 70° C (-40° F ~ 158° F)
90%, non-condensing at 35° C
Non-operating Relative Humidity: 10% to
95% (non-condensing)
Yes
Yes
BIOS
Brand / ROM size
Graphic
Resolution
Chipset
Chipset
Version
USB
COM
Audio
VGA
DVI
Display Port
Power
RJ-45
Power
Front Panel
SATA
Chipset
Feature
Audio
Form Factor
Form Factor
Board Dimension
FCC (DoC)
CE (DoC)
Operating Temp.
Non-operating Temp.
In/Non-operating
Humidity
RoHS 6/6 Complaint
Operating System
OS supported list
Regulation
Input /Output
Operating
Environment
RoHS
ErP/EuP
(Specifications are subject to change without notice. Items pictured may only be representative.)
System
Monitoring
Voltage
Fan
Temperature
MITAC INTERNATIONAL CORP.
TYAN Business Unit
USA
Tel: +1-510-651-8868
Fax: +1-510-651-7688
Taiwan
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