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MK74ZD133Y

产品描述PLL Based Clock Driver, ZD Series, 32 True Output(s), 0 Inverted Output(s), CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, LQFP-64
产品类别逻辑    逻辑   
文件大小115KB,共8页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

MK74ZD133Y概述

PLL Based Clock Driver, ZD Series, 32 True Output(s), 0 Inverted Output(s), CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, LQFP-64

MK74ZD133Y规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP,
针数64
Reach Compliance Codecompliant
系列ZD
输入调节STANDARD
JESD-30 代码S-PQFP-G64
JESD-609代码e0
长度10 mm
逻辑集成电路类型PLL BASED CLOCK DRIVER
功能数量1
反相输出次数
端子数量64
实输出次数32
最高工作温度70 °C
最低工作温度
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.2 ns
座面最大高度1.6 mm
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度10 mm
最小 fmax133.34 MHz

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PRELIMINARY INFORMATION
MK74ZD133
PLL and 32-Output Clock Driver
Features
• 56 pin SSOP or 64 pin LQFP package
• On-chip PLL generates output clocks up to
80 MHz (SSOP) or 133.33 MHz (LQFP)
• Zero delay plus multiplier function
• 32 low-skew outputs can eliminate chip-to-chip
skew concerns in systems with less than 33 clocks
• Output to output skew of 200 ps (with stagger)
• Device to device skew of 700ps
• Staggered, fixed skew helps reduce EMI
• Tri-state (Output Enable) pin
• Output blocks can be independently powered off
• 250 ps typical fixed delay between input and
output in “Multiplier” mode
• Ideal for Fast Ethernet and Gigabit Ethernet
designs
• Good for video servers
• 3.3V±5% supply voltage
Description
The MK74ZD133 is a monolithic CMOS high
speed clock driver that includes an on-chip PLL
(Phase Locked Loop). Ideal for communications
and other systems that require a large number of
high-speed clocks, the unique combination of PLL
and 32 outputs can eliminate oscillators and
multiple low skew buffers. With 32 outputs
included in one device, there is also no need to
worry about chip-to-chip skew. The zero delay
modes cause the input clock rising edge to be
synchronized with all of the outputs’ rising edges.
The MK74ZD133 has a large selection of built-in
multipliers, making it possible to run from a clock
input as low as 10 MHz and generate high
frequency outputs up to 80 MHz in the SSOP. For
speeds up to 133.33 MHz, use the LQFP package.
Block Diagram
Optional External Connection to Output 3 (for Zero Delay Mode)
VDD
GND
FBIN
S4:0
5
Clock
Synthesis
Circuitry
Output
Buffer
Output
Buffer
Output
Buffer
Output 1
Output 2
Output 3
Clock input
Input
Buffer
Output
Buffer
Output 32
OE (all outputs)
MDS 74ZD133 C
1
Revision 010899
Printed 11/17/00
Integrated Circuit Systems, Inc.•525 Race Street•San Jose•CA•95126•(408)295-9800tel•www.icst.com

MK74ZD133Y相似产品对比

MK74ZD133Y MK74ZD133YT MK74ZD133F MK74ZD133FT
描述 PLL Based Clock Driver, ZD Series, 32 True Output(s), 0 Inverted Output(s), CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, LQFP-64 PLL Based Clock Driver, ZD Series, 32 True Output(s), 0 Inverted Output(s), CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, LQFP-64 PLL Based Clock Driver, ZD Series, 32 True Output(s), 0 Inverted Output(s), CMOS, PDSO56, 0.300 INCH, SSOP-56 PLL Based Clock Driver, ZD Series, 32 True Output(s), 0 Inverted Output(s), CMOS, PDSO56, 0.300 INCH, SSOP-56
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP SSOP SSOP
包装说明 LFQFP, LFQFP, SSOP, SSOP,
针数 64 64 56 56
Reach Compliance Code compliant compliant compliant compliant
系列 ZD ZD ZD ZD
输入调节 STANDARD STANDARD STANDARD STANDARD
JESD-30 代码 S-PQFP-G64 S-PQFP-G64 R-PDSO-G56 R-PDSO-G56
JESD-609代码 e0 e0 e0 e0
长度 10 mm 10 mm 18.415 mm 18.415 mm
逻辑集成电路类型 PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
功能数量 1 1 1 1
端子数量 64 64 56 56
实输出次数 32 32 32 32
最高工作温度 70 °C 70 °C 70 °C 70 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP SSOP SSOP
封装形状 SQUARE SQUARE RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED 225 225
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
Same Edge Skew-Max(tskwd) 0.2 ns 0.2 ns 0.2 ns 0.2 ns
座面最大高度 1.6 mm 1.6 mm 2.794 mm 2.794 mm
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.635 mm 0.635 mm
端子位置 QUAD QUAD DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED 30 30
宽度 10 mm 10 mm 7.5 mm 7.5 mm
最小 fmax 133.34 MHz 133.34 MHz 80 MHz 80 MHz

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