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LH28F800BVE-BV85

产品描述Flash, 512KX16, 85ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48
产品类别存储    存储   
文件大小510KB,共49页
制造商SHARP
官网地址http://sharp-world.com/products/device/
下载文档 详细参数 全文预览

LH28F800BVE-BV85概述

Flash, 512KX16, 85ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48

LH28F800BVE-BV85规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称SHARP
包装说明12 X 20 MM, PLASTIC, TSOP-48
Reach Compliance Codeunknown
最长访问时间85 ns
备用内存宽度8
启动块BOTTOM
命令用户界面YES
数据轮询NO
JESD-30 代码R-PDSO-G48
JESD-609代码e0
长度18.4 mm
内存密度8388608 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模8,15
端子数量48
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装等效代码TSSOP48,.8,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
编程电压5 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1.2 mm
部门规模8K,64K
最大待机电流0.000005 A
最大压摆率0.065 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位NO
类型NOR TYPE
宽度12 mm

LH28F800BVE-BV85文档预览

P
RODUCT
S
PECIFICATIONS
®
Integrated Circuits Group
LH28F800BVE-BV85
8M (1MB × 8 / 512KB × 16)
(Model No.: LHF80V35)
Flash Memory
Spec No.: EL109091B
Issue Date: September 28, 1999
sharp
LHF80V35
●Handle
this document carefully for it contains material protected by international copyright law.
Any reproduction, full or in part, of this material is prohibited without the express written
permission of the company.
●When
using the products covered herein, please observe the conditions written herein and the
precautions outlined in the following paragraphs. In no event shall the company be liable for any
damages resulting from failure to strictly adhere to these conditions and precautions.
(1) The products covered herein are designed and manufactured for the following application
areas. When using the products covered herein for the equipment listed in Paragraph (2),
even for the following application areas, be sure to observe the precautions given in
Paragraph (2). Never use the products for the equipment listed in Paragraph (3).
•Office
electronics
•Instrumentation
and measuring equipment
•Machine
tools
•Audiovisual
equipment
•Home
appliance
•Communication
equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following equipment which
demands high reliability, should first contact a sales representative of the company and then
accept responsibility for incorporating into the design fail-safe operation, redundancy, and
other appropriate measures for ensuring reliability and safety of the equipment and the
overall system.
•Control
and safety devices for airplanes, trains, automobiles, and other
transportation equipment
•Mainframe
computers
•Traffic
control systems
•Gas
leak detectors and automatic cutoff devices
•Rescue
and security equipment
•Other
safety devices and safety equipment, etc.
(3) Do not use the products covered herein for the following equipment which demands
extremely high performance in terms of functionality, reliability, or accuracy.
•Aerospace
equipment
•Communications
equipment for trunk lines
•Control
equipment for the nuclear power industry
•Medical
equipment related to life support, etc.
(4) Please direct all queries and comments regarding the interpretation of the above three
Paragraphs to a sales representative of the company.
●Please
direct all queries regarding the products covered herein to a sales representative of the
company.
Rev. 1.1
sharp
LHF80V35
1
CONTENTS
PAGE
1 INTRODUCTION.............................................................. 3
1.1 Features ........................................................................ 3
1.2 Product Overview......................................................... 3
2 PRINCIPLES OF OPERATION........................................ 7
2.1 Data Protection............................................................. 8
3 BUS OPERATION ............................................................ 8
3.1 Read.............................................................................. 8
3.2 Output Disable.............................................................. 8
3.3 Standby......................................................................... 8
3.4 Deep Power-Down ....................................................... 8
3.5 Read Identifier Codes Operation .................................. 9
3.6 Write............................................................................. 9
4 COMMAND DEFINITIONS............................................. 9
4.1 Read Array Command................................................ 12
4.2 Read Identifier Codes Command ............................... 12
4.3 Read Status Register Command ................................. 12
4.4 Clear Status Register Command................................. 12
4.5 Block Erase Command............................................... 12
4.6 Word/Byte Write Command....................................... 13
4.7 Block Erase Suspend Command ................................ 13
4.8 Word/Byte Write Suspend Command ........................ 14
4.9 Considerations of Suspend ......................................... 14
4.10 Block Locking .......................................................... 14
4.10.1 V
PP
=V
IL
for Complete Protection ...................... 14
4.10.2 WP#=V
IL
for Block Locking.............................. 14
4.10.3 WP#=V
IH
for Block Unlocking.......................... 14
PAGE
5 DESIGN CONSIDERATIONS ...................................... 20
5.1 Three-Line Output Control ....................................... 20
5.2 RY/BY# and Block Erase and Word/Byte Write
Polling...................................................................... 20
5.3 Power Supply Decoupling ........................................ 20
5.4 V
PP
Trace on Printed Circuit Boards ........................ 20
5.5 V
CC
, V
PP
, RP# Transitions ....................................... 21
5.6 Power-Up/Down Protection...................................... 21
5.7 Power Dissipation ..................................................... 21
6 ELECTRICAL SPECIFICATIONS ............................... 22
6.1 Absolute Maximum Ratings ..................................... 22
6.2 Operating Conditions ................................................ 22
6.2.1 Capacitance ......................................................... 22
6.2.2 AC Input/Output Test Conditions ....................... 23
6.2.3 DC Characteristics .............................................. 24
6.2.4 AC Characteristics - Read-Only Operations ....... 26
6.2.5 AC Characteristics - Write Operations ............... 29
6.2.6 Alternative CE#-Controlled Writes..................... 31
6.2.7 Reset Operations ................................................. 33
6.2.8 Block Erase and Word/Byte Write Performance 34
7 PACKAGE AND PACKING SPECIFICATIONS......... 35
Rev. 1.1
sharp
LHF80V35
2
LH28F800BVE-BV85
8M-BIT (1Mbit × 8 / 512Kbit × 16)
Smart5 Flash MEMORY
Smart5 Technology
4.5V-5.5V V
CC
4.5V-5.5V or 11.4V-12.6V V
PP
User-Configurable ×8 or ×16 Operation
High-Performance Access Time
85ns(4.5V-5.5V)
Operating Temperature
0°C to +70°C
Optimized Array Blocking Architecture
Two 4K-word Boot Blocks
Six 4K-word Parameter Blocks
Fifteen 32K-word Main Blocks
Bottom Boot Location
Extended Cycling Capability
100,000 Block Erase Cycles
Enhanced Automated Suspend Options
Word/Byte Write Suspend to Read
Block Erase Suspend to Word/Byte Write
Block Erase Suspend to Read
Enhanced Data Protection Features
Absolute Protection with V
PP
=GND
Block Erase and Word/Byte Write Lockout
during Power Transitions
Boot Blocks Protection with WP#=V
IL
Automated Word/Byte Write and Block Erase
Command User Interface
Status Register
Low Power Management
Deep Power-Down Mode
Automatic Power Savings Mode Decreases
I
CC
in Static Mode
SRAM-Compatible Write Interface
Industry-Standard Packaging
48-Lead TSOP
ETOX
TM*
Nonvolatile Flash Technology
CMOS Process (P-type silicon substrate)
Not designed or rated as radiation hardened
SHARP’s LH28F800BVE-BV85 Flash memory with Smart5 technology is a high-density, low-cost, nonvolatile, read/write
storage solution for a wide range of applications. LH28F800BVE-BV85 can operate at V
CC
=4.5V-5.5V and V
PP
=4.5V-5.5V.
Its low voltage operation capability realize battery life and suits for cellular phone application.
Its Boot, Parameter and Main-blocked architecture, flexible voltage and extended cycling provide for highly flexible
component suitable for portable terminals and personal computers. Its enhanced suspend capabilities provide for an ideal
solution for code + data storage applications. For secure code storage applications, such as networking, where code is either
directly executed out of flash or downloaded to DRAM, the LH28F800BVE-BV85 offers two levels of protection: absolute
protection with V
PP
at GND, selective hardware boot block locking. These alternatives give designers ultimate control of their
code security needs.
The LH28F800BVE-BV85 is manufactured on SHARP’s 0.35µm ETOX
TM*
process technology. It come in industry-standard
package: the 48-lead TSOP ideal for board constrained applications.
*ETOX is a trademark of Intel Corporation.
Rev. 1.1

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