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CY7C1370DV25-200BGCT

产品描述ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
产品类别存储    存储   
文件大小546KB,共27页
制造商Cypress(赛普拉斯)
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CY7C1370DV25-200BGCT概述

ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119

CY7C1370DV25-200BGCT规格参数

参数名称属性值
厂商名称Cypress(赛普拉斯)
零件包装代码BGA
包装说明14 X 22 MM, 2.40 MM HEIGHT, BGA-119
针数119
Reach Compliance Codeunknown
ECCN代码3A991.B.2.A
最长访问时间3 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B119
JESD-609代码e0
长度22 mm
内存密度18874368 bit
内存集成电路类型ZBT SRAM
内存宽度36
功能数量1
端子数量119
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX36
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
认证状态Not Qualified
座面最大高度2.4 mm
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
宽度14 mm

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CY7C1370DV25
CY7C1372DV25
18-Mbit (512K x 36/1M x 18)
Pipelined SRAM with NoBL™ Architecture
Features
• Pin-compatible and functionally equivalent to ZBT™
• Supports 250-MHz bus operations with zero wait states
— Available speed grades are 250, 200 and 167 MHz
• Internally self-timed output buffer control to eliminate
the need to use asynchronous OE
• Fully registered (inputs and outputs) for pipelined
operation
• Byte Write capability
• Single 2.5V core power supply (V
DD
)
• 2.5V I/O power supply (V
DDQ
)
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Available in JEDEC-standard lead-free 100-Pin TQFP,
lead-free and non-lead-free 119-Ball BGA and 165-Ball
FBGA packages
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst capability—linear or interleaved burst order
• “ZZ” Sleep Mode option and Stop Clock option
Functional Description
The CY7C1370DV25 and CY7C1372DV25 are 2.5V, 512K x
36 and 1 Mbit x 18 Synchronous pipelined burst SRAMs with
No Bus Latency™ (NoBL™) logic, respectively. They are
designed to support unlimited true back-to-back Read/Write
operations with no wait states. The CY7C1370DV25 and
CY7C1372DV25 are equipped with the advanced (NoBL) logic
required to enable consecutive Read/Write operations with
data being transferred on every clock cycle. This feature
dramatically improves the throughput of data in systems that
require frequent Write/Read transitions. The CY7C1370DV25
and CY7C1372DV25 are pin-compatible and functionally
equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which when deasserted suspends operation and extends the
previous clock cycle.
Write operations are controlled by the Byte Write Selects
(BW
a
–BW
d
for CY7C1370DV25 and BW
a
–BW
b
for
CY7C1372DV25) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output three-state control. In order to avoid bus
contention, the output drivers are synchronously three-stated
during the data portion of a write sequence.
Logic Block Diagram-CY7C1370DV25 (512K x 36)
A0, A1, A
MODE
CLK
CEN
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
A0'
BURST
D0
Q0
LOGIC
ADV/LD
C
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
C
ADV/LD
BW
a
BW
b
BW
c
BW
d
WE
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
E
DQs
DQP
a
DQP
b
DQP
c
DQP
d
E
INPUT
REGISTER 1
E
INPUT
REGISTER 0
E
OE
CE1
CE2
CE3
ZZ
READ LOGIC
SLEEP
CONTROL
Cypress Semiconductor Corporation
Document #: 38-05558 Rev. *D
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised June 29, 2006
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