4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5
4K × 8 I2C/2-线 串行 电可擦除只读存储器, PDSO5
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | TSOT |
| 包装说明 | TSSOP, TSOP5/6,.11,37 |
| 针数 | 5 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 1 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010000R |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e3 |
| 长度 | 2.9 mm |
| 内存密度 | 32768 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.6 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| AT24C32D-STUM-T | AT24C32D | AT24C32D-CUM-T | AT24C32D-XHM-B | AT24C64D | AT24C32D-MAHM-T | AT24C32D-MEHM-T | |
|---|---|---|---|---|---|---|---|
| 描述 | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5 | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | 8 | 8 | 8 | 8 | 8 | 8 |
| 组织 | 4KX8 | 4K × 8 | 4KX8 | 4KX8 | 4K × 8 | 4KX8 | 4KX8 |
| 表面贴装 | YES | Yes | YES | YES | Yes | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | BALL | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子位置 | DUAL | 双 | BOTTOM | DUAL | 双 | DUAL | DUAL |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | TSOT | - | BGA | TSSOP | - | SON | DFN |
| 包装说明 | TSSOP, TSOP5/6,.11,37 | - | VFBGA, BGA8,2X4,40/20 | TSSOP, TSSOP8,.25 | - | HVSON, SOLCC8,.11,20 | VSON, SOLCC8,.08,16 |
| 针数 | 5 | - | 8 | 8 | - | 8 | 8 |
| Reach Compliance Code | compliant | - | compli | compliant | - | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 1 MHz | - | 1 MHz | 1 MHz | - | 1 MHz | 1 MHz |
| 数据保留时间-最小值 | 100 | - | 100 | 100 | - | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010000R | - | 1010DDDR | 1010DDDR | - | 1010DDDR | 1010DDDR |
| JESD-30 代码 | R-PDSO-G5 | - | R-PBGA-B8 | R-PDSO-G8 | - | R-PDSO-N8 | R-XDSO-N8 |
| JESD-609代码 | e3 | - | e3 | e4 | - | e4 | e4 |
| 长度 | 2.9 mm | - | 2 mm | 4.4 mm | - | 3 mm | 2.2 mm |
| 内存密度 | 32768 bit | - | 32768 bi | 32768 bit | - | 32768 bit | 32768 bit |
| 内存集成电路类型 | EEPROM | - | EEPROM | EEPROM | - | EEPROM | EEPROM |
| 字数 | 4096 words | - | 4096 words | 4096 words | - | 4096 words | 4096 words |
| 字数代码 | 4000 | - | 4000 | 4000 | - | 4000 | 4000 |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | TSSOP | - | VFBGA | TSSOP | - | HVSON | VSON |
| 封装等效代码 | TSOP5/6,.11,37 | - | BGA8,2X4,40/20 | TSSOP8,.25 | - | SOLCC8,.11,20 | SOLCC8,.08,16 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 并行/串行 | SERIAL | - | SERIAL | SERIAL | - | SERIAL | SERIAL |
| 电源 | 2/5 V | - | 2/5 V | 2/5 V | - | 2/5 V | 2/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | - | 0.85 mm | 1.2 mm | - | 0.6 mm | 0.4 mm |
| 串行总线类型 | I2C | - | I2C | I2C | - | I2C | I2C |
| 最大待机电流 | 0.000001 A | - | 0.000001 A | 0.000001 A | - | 0.000001 A | 0.000001 A |
| 最大压摆率 | 0.003 mA | - | 0.003 mA | 0.003 mA | - | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | - | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS | CMOS |
| 端子面层 | MATTE TIN | - | MATTE TIN | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子节距 | 0.95 mm | - | 0.5 mm | 0.65 mm | - | 0.5 mm | 0.4 mm |
| 宽度 | 1.6 mm | - | 1.5 mm | 3 mm | - | 2 mm | 1.8 mm |
| 最长写入周期时间 (tWC) | 5 ms | - | 5 ms | 5 ms | - | 5 ms | 5 ms |
| 写保护 | HARDWARE | - | HARDWARE | HARDWARE | - | HARDWARE | HARDWARE |
| Base Number Matches | 1 | - | - | 1 | - | 1 | 1 |
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