LV/LV-A/LVX/H SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH DIRECTION CONTROL |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 传播延迟（tpd） | 18 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| SN54LV245FK | SN74LV245DW | SN54LV245J | SN54LV245W | |
|---|---|---|---|---|
| 描述 | LV/LV-A/LVX/H SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | Octal Bus Transceiver With 3-State Output 20-SOIC -40 to 85 | LV/LV-A/LVX/H SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDIP20, 0.300 INCH, CERAMIC, DIP-20 | LV/LV-A/LVX/H SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC | SOIC | DIP | DFP |
| 包装说明 | QCCN, | SOP, SOP20,.4 | DIP, | DFP, |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown |
| 其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | S-CQCC-N20 | R-PDSO-G20 | R-GDIP-T20 | R-GDFP-F20 |
| 长度 | 8.89 mm | 12.8 mm | 24.195 mm | 13.09 mm |
| 逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | SOP | DIP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 18 ns | 18 ns | 18 ns | 18 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 2.65 mm | 5.08 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | NO LEAD | GULL WING | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 8.89 mm | 7.5 mm | 7.62 mm | 6.92 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
