IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,24PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 25C 时的最大偏置电流 (IIB) | 0.0005 µA |
| 频率补偿 | YES |
| 最大输入失调电压 | 25000 µV |
| JESD-30 代码 | R-XDIP-T24 |
| JESD-609代码 | e0 |
| 低-偏置 | YES |
| 低-失调 | NO |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 功率 | YES |
| 电源 | +-15 V |
| 最小摆率 | 200 V/us |
| 最大压摆率 | 40 mA |
| 供电电压上限 | 17 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 最小电压增益 | 710 |
| LH4101CD/A+ | LH4101D | LH4101CD | LH4101D/883B | LH4101D/883 | LH4101D/883C | |
|---|---|---|---|---|---|---|
| 描述 | IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,24PIN,CERAMIC | OP-AMP, 25000uV OFFSET-MAX, 45MHz BAND WIDTH, CDIP24, HYBRID, HERMETIC SEALED, SIDE BRAZED, DIP-24 | OP-AMP, 25000uV OFFSET-MAX, 45MHz BAND WIDTH, CDIP24, HYBRID, HERMETIC SEALED, SIDE BRAZED, DIP-24 | IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,24PIN,CERAMIC | IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,24PIN,CERAMIC | IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,24PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 25C 时的最大偏置电流 (IIB) | 0.0005 µA | 0.0005 µA | 0.0005 µA | 0.0005 µA | 0.0005 µA | 0.0005 µA |
| 频率补偿 | YES | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 25000 µV | 25000 µV | 25000 µV | 25000 µV | 25000 µV | 25000 µV |
| JESD-30 代码 | R-XDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低-偏置 | YES | YES | YES | YES | YES | YES |
| 低-失调 | NO | NO | NO | NO | NO | NO |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -25 °C | -55 °C | -25 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 功率 | YES | YES | YES | YES | YES | YES |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 最小摆率 | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us |
| 最大压摆率 | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA | 40 mA |
| 供电电压上限 | 17 V | 17 V | 17 V | 17 V | 17 V | 17 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 温度等级 | OTHER | MILITARY | OTHER | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最小电压增益 | 710 | 710 | 710 | 710 | 710 | 710 |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
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