Analog Waveform Generation Function, CMOS, CDIP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | General Electric Solid State |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| ICM7556MJD | ICM7556MJD/883B | ICM7556MJD/C | ICM7556MJD/HR | ICM7555MTV/HR | ICM7555MTV/883B | ICM7555MTY | ICM7555CBA-T | ICM7555IBA | ICM7555IBAT | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Analog Waveform Generation Function, CMOS, CDIP14, | Analog Waveform Generation Function, CMOS, CDIP14, | Analog Waveform Generation Function, CMOS, CDIP14 | Analog Waveform Generation Function, CMOS, CDIP14 | Analog Waveform Generation Function, CMOS, MBCY8 | Analog Waveform Generation Function, CMOS, MBCY8, | Analog Waveform Generation Function, CMOS, MBCY8 | Analog Waveform Generation Function, CMOS, PDSO8, | Analog Waveform Generation Function, CMOS, PDSO8, | Analog Waveform Generation Function, CMOS, PDSO8, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | , CAN8,.2 | , CAN8,.2 | , CAN8,.2 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | O-MBCY-W8 | O-MBCY-W8 | O-MBCY-W8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 14 | 14 | 14 | 14 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -20 °C | -20 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | METAL | METAL | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | CAN8,.2 | CAN8,.2 | CAN8,.2 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | ROUND | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5 V | 5/15 V | 5 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE | WIRE | WIRE | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | BOTTOM | DUAL | DUAL | DUAL |
| 厂商名称 | General Electric Solid State | - | - | - | - | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State | General Electric Solid State |
| 封装代码 | DIP | DIP | DIP | DIP | - | - | - | SOP | SOP | SOP |
| 表面贴装 | NO | NO | NO | NO | - | - | - | YES | YES | YES |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - | - | 1.27 mm | 1.27 mm | 1.27 mm |
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