HC/UH SERIES, TRIPLE 3-INPUT OR GATE, CDIP14, 0.300 INCH, CERAMIC, DIP-14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| 系列 | HC/UH |
| JESD-30 代码 | R-GDIP-T14 |
| 逻辑集成电路类型 | OR GATE |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/6 V |
| 传播延迟（tpd） | 150 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | MIL-PRF-38535 |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| SNJ54HC4075J | SN54HC4075FK-00 | SNJ54HC4075J-00 | SN54HC4075J-00 | SNJ54HC4075FK-00 | |
|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, TRIPLE 3-INPUT OR GATE, CDIP14, 0.300 INCH, CERAMIC, DIP-14 | HC/UH SERIES, TRIPLE 3-INPUT OR GATE, CQCC20 | HC/UH SERIES, TRIPLE 3-INPUT OR GATE, CDIP14 | HC/UH SERIES, TRIPLE 3-INPUT OR GATE, CDIP14 | HC/UH SERIES, TRIPLE 3-INPUT OR GATE, CQCC20 |
| 包装说明 | DIP, DIP14,.3 | QCCN, | DIP, | DIP, | QCCN, |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-GDIP-T14 | S-CQCC-N20 | R-GDIP-T14 | R-GDIP-T14 | S-CQCC-N20 |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 功能数量 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 20 | 14 | 14 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | DIP | DIP | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| 传播延迟（tpd） | 150 ns | 30 ns | 30 ns | 30 ns | 30 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.03 mm | 5.08 mm | 5.08 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 长度 | - | 8.89 mm | 19.56 mm | 19.56 mm | 8.89 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF |
电源技术
无线连接
单片机
嵌入式系统
无线连接
Silicon Labs测评专区
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
