Dual-Port SRAM, 4KX8, 20ns, CMOS, PQCC52, PLASTIC, LCC-52
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | LCC |
包装说明 | PLASTIC, LCC-52 |
针数 | 52 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 20 ns |
其他特性 | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
I/O 类型 | COMMON |
JESD-30 代码 | S-PQCC-J52 |
JESD-609代码 | e0 |
长度 | 19.1262 mm |
内存密度 | 32768 bit |
内存集成电路类型 | DUAL-PORT SRAM |
内存宽度 | 8 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 52 |
字数 | 4096 words |
字数代码 | 4000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 4KX8 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC52,.8SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 225 |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大待机电流 | 0.0045 A |
最小待机电流 | 2 V |
最大压摆率 | 0.24 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 19.1262 mm |
IDT71342LA20J | IDT71342LA20JG | IDT71342LA20JG8 | IDT71342LA20PFG8 | IDT71342LA20PFG | |
---|---|---|---|---|---|
描述 | Dual-Port SRAM, 4KX8, 20ns, CMOS, PQCC52, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX8, 20ns, CMOS, PQCC52, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX8, 20ns, CMOS, PQCC52, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX8, 20ns, CMOS, PQFP64, PLASTIC, TQFP-64 | Dual-Port SRAM, 4KX8, 20ns, CMOS, PQFP64, PLASTIC, TQFP-64 |
是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | LCC | LCC | LCC | QFP | QFP |
包装说明 | PLASTIC, LCC-52 | QCCJ, | QCCJ, | LQFP, | LQFP, |
针数 | 52 | 52 | 52 | 64 | 64 |
Reach Compliance Code | not_compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
其他特性 | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP |
JESD-30 代码 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQFP-G64 | S-PQFP-G64 |
JESD-609代码 | e0 | e3 | e3 | e3 | e3 |
长度 | 19.1262 mm | 19.1262 mm | 19.1262 mm | 14 mm | 14 mm |
内存密度 | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 52 | 52 | 52 | 64 | 64 |
字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | LQFP | LQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 225 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 1.6 mm | 1.6 mm |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | J BEND | J BEND | J BEND | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
宽度 | 19.1262 mm | 19.1262 mm | 19.1262 mm | 14 mm | 14 mm |
湿度敏感等级 | 3 | - | - | 3 | 3 |
Base Number Matches | - | 1 | 1 | 1 | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved