iC-TW3
SENSOR SIGNAL CONDITIONER WITH
TEMPERATURE COMPENSATION AND LINE DRIVER
Rev B1, Page 1/24
FEATURES
o
o
o
o
o
o
o
o
o
o
o
o
o
o
Fully differential 3-channel signal conditioning
PGS inputs for differential and single-ended signals
Overall gain of -3 to 57 dB, adjustable in steps of 0.08 dB
Output referred offset range of ±1.2 V, adjustable in steps of
2 mV
Signal bandwidth to 1 MHz and in/out latency below 1 µs
Selectable automatic gain and offset control for encoder
applications
On-chip or off-chip temperature sensing
Temperature drift compensation for gain and offset via
programmable look-up-tables
Short-circuit-proof outputs: 1 Vpp to 100
Ω,
2 Vpp to 1 kΩ
I
2
C interface to restore device setup from serial EEPROM
Bidirectional 1-wire interface for direct RAM and EEPROM
access
Optical setup link via 1-wire interface operating a photo
receiver
Single 3.0 V to 5.5 V supply
Operating temperature range of -40 to +125 °C
APPLICATIONS
o
Programmable general purpose
sensor interface
o
Optical position sensors
o
Magnetic position sensors
o
Incremental position sensors
o
Linear scales
PACKAGES
QFN32
BLOCK DIAGRAM
Copyright © 2009 iC-Haus
http://www.ichaus.com
iC-TW3
SENSOR SIGNAL CONDITIONER WITH
TEMPERATURE COMPENSATION AND LINE DRIVER
Rev B1, Page 2/24
DESCRIPTION
The general purpose sensor signal conditioner iC-
TW3 provides highly accurate non contact trimming
of three independent sine/cosine sensor signals. The
differential output signals can be calibrated to 1 Vpp
or to 2 Vpp, alternatively.
The internal or an external temperature sensor linked
to the chip can influence the gain and offset correc-
tion by arbitrary temperature-dependent compensa-
tion parameters sourced from a look-up table.
For encoder applications an automatic gain and off-
set control compensates sensor offset voltages and
stabilizes the output signal level.
The direct connection of sine/cosine encoders, MR
sensor bridges or photosensor arrays is possible and
supported by a selectable input impedance.
iC-TW3
SENSOR SIGNAL CONDITIONER WITH
TEMPERATURE COMPENSATION AND LINE DRIVER
Rev B1, Page 3/24
PACKAGES
PIN CONFIGURATION QFN32 5 mm x 5 mm
PIN FUNCTIONS
No. Name
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PINZ
NINZ
TESTEN
CLK
NZO
ZO
GNDB
VDDB
NBO
BO
GND
SCL
SDA
VDD
GNDA
n.c.
AO
NAO
VDDA
1W
NERR
NRST
NSTORE*
n.c.
NINA
PINA
KELVIN
GNDIN
VDDIN
PINB
NINB
VC
Signal Input Z+
Signal Input Z-
Test Mode Enable Input
External Clock Input
Signal Output Z-
Signal Output Z+
Driver Ground
+3...+5.5 V Driver Supply Voltage
Signal Output B-
Signal Output B+
Digital Ground
I2C Interface, clock line
I2C interface, data line
+3...+5.5 V Digital Supply Voltage
Driver Ground
not connected
Signal Output A+
Signal Output A-
+3...+5.5 V Driver Supply Voltage
1-Wire Interface, bidirectional port
Error Message Output, active low
External Reset Input, active low
Coefficient Store Input, active low
not connected
Signal Input A-
Signal Input A+
External Temperature Sensor Input
Input Ground
+3...+5.5 V Input Supply Voltage
Signal Input B+
Signal Input B-
1.21 V Reference Voltage Output,
Reference Voltage Input
Thermal Pad
32 31 30 29 28 27 26 25
1
2
3
4
5
6
7
8
24
23
22
TW3
code...
...
9
10
11 12 13 14 15 16
21
20
19
18
17
TP TP**
Notes:
*) Pin NSTORE should be wired to VDD.
**) The Thermal Pad of the QFN package (bottom side) is to be connected to a ground plane on the PCB which
must have GND potential.
iC-TW3
SENSOR SIGNAL CONDITIONER WITH
TEMPERATURE COMPENSATION AND LINE DRIVER
Rev B1, Page 4/24
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.
Item
No.
Symbol
Parameter
Conditions
Min.
Voltage at VDD, VDDA, VDDB, VDDIN referenced to GND, GNDA, GNDB, GNDIN
Voltage applied to any other pin
Voltage Difference VDDA, VDDB vs.
VDD
Voltage Difference VDDIN vs. VDD
Voltage Difference GNDA, GNDB vs.
GND
Voltage Difference GNDIN vs. GND
ESD Susceptibility Of Signal Outputs:
AO, NAO, BO, NBO, ZO, NZO
ESD Susceptibility (remaining pins)
Junction Temperature
Storage Temperature
HBM, 100 pF discharged through 1.5 kΩ
HBM, 100 pF discharged through 1.5 kΩ
-40
-40
referenced to GND
-0.3
-0.3
Max.
6.0
VDD +
0.5
0.5
0.5
0.5
0.5
2
2
150
150
V
V
V
V
V
V
kV
kV
°C
°C
Unit
G001 VDDx()
G002 V()
G003 V()
G004 V()
G005 V()
G006 V()
G007 Vd
G008 Vd
G009 Tj
G010 Ts
THERMAL DATA
Item
No.
T01
T02
Symbol
Ta
Rthja
Parameter
Operating Ambient Temperature Range
Thermal Resistance Chip To Ambient
surface mounted to PCB according
to JEDEC 51
Conditions
Min.
-40
40
Typ.
Max.
125
°C
K/W
Unit
All voltages are referenced to ground unless otherwise stated.
All currents into the device pins are positive; all currents out of the device pins are negative.
iC-TW3
SENSOR SIGNAL CONDITIONER WITH
TEMPERATURE COMPENSATION AND LINE DRIVER
Rev B1, Page 5/24
ELECTRICAL CHARACTERISTICS
Operating conditions: VDD, VDDA, VDDB, VDDIN = 3.0...5.5 V, Tj = -40...125 °C, reference point GND unless otherwise stated
Item
No.
001
002
003
004
101
102
103
104
105
106
107
108
Symbol
Parameter
Conditions
Min.
VDDx
I(VDDx)
Vc()hi
Vc()lo
Vin()sig
Vin()os
Iin()
Rpu()
fg
CMRR
PSRR
e
n
Permissible Supply Voltage
at VDD, VDDA, VDDB, VDDIN
Total Supply Current
Clamp-Voltage hi at all pins
Clamp-Voltage lo at all pins
Permissible Input Voltage Range
Input Offset Voltage
Input Current
Input Pull-Up Resistor
-3 dB Bandwidth
Common Mode Rejection Ratio
Power Supply Rejection Ratio
Input Voltage Noise
ENSIGAB = 0, ENSIGZ = 0
ENSIGAB = 1, ENSIGZ = 1
PGA gain of 36 dB
fc < 1 MHz
fc < 1 kHz
fc < 1 MHz
fc < 1 kHz
f = 1 kHz
f = 100 Hz
f = 0.1 to 10 Hz
-35
2.0
1.2
40
60
40
60
20 n
25 n
2µ
0.08
2
-50
± 10
1.7
0.9
-50
19
10
224
245
1.10
0
-0.1
1.21
1.35
2.21
1
3.0
2.6
1.5
3.3
0.8
1.0
-3
700
V
V
µA
V
V
V
V
V
V
µA
mV
50
150
2.5
VDDx = 3.3 V
VDDx = 5.5 V
Vc()hi = V() - VDD; I() = 10 mA
I() = -10 mA
0.3
-1.2
1.4
±5
3.0
Typ.
Max.
5.5
15
25
1.4
-0.3
VDD -
1.2 V
±15
35
3
V
mA
mA
V
V
V
mV
nA
MΩ
MHz
dB
dB
dB
dB
√
V/
√
Hz
V/
√
Hz
V/ Hz
dB
mV
°C
°C
V
V
nA
Unit
Total Device
Analog Signal Inputs PINA, NINA, PINB, NINB, PINZ, NINZ
109
110
201
202
203
204
205
∆DGAIN
∆DOFFS
Tor
Tacc
Vin()low
Iin()
T()lo
Dynamic Gain Step Width
Dynamic Offset Step Width
Int. Temperature Sensor Operat- after calibration of ADC;
ing Range
Device-To-Device Temp. Sensor
Variation
Temperature Input Voltage
Input Current at KELVIN
Lo-Temperature ADC Reading,
via Register CELSIUS(7:0)
Hi-Temperature ADC Reading,
via Register CELSIUS(7:0)
after calibration of ADC,
Tj = -40 °C to 125 °C
CELSIUS(7:0) = 10
CELSIUS(7:0) = 245
V(KELVIN) = 0 .. VDD
after calibration of ADC;
XCELSIUS = 0, internal sensor: Tj = -40 °C
XCELSIUS = 1, ext. sensor: V(KELVIN) = 1.7 V
after calibration of ADC;
XCELSIUS = 0, internal sensor: Tj = 125 °C
XCELSIUS = 1, ext. sensor: V(KELVIN) = 0.9 V
VEXT = 0; CL = 100 nF, I() = 0 mA
Temperature Sensor and Analog Input KELVIN
206
T()hi
Reference Voltage Input/Output VC
301
302
303
401
402
403
404
405
406
Vout(VC)
Vin(VC)
Iin(VC)
VDDon
VDDoff
Vt()hi
Vt()lo
Ipu()
Vpu()
Reference Voltage Output
Permissible Input Voltage Range VEXT = 1
at VC
Input Current at VC
Turn-On Threshold (power-on
release)
VEXT = 1
increasing voltage at VDD
Power-On Reset and Input NRST
Turn-Off Threshold (power-down decreasing voltage at VDD
reset)
Input Threshold Voltage hi
Input Threshold Voltage lo
Input Pull-Up Current
Input Pull-Up Voltage
VDD = 3.3 V +/- 10 %
VDD = 5.0 V +/- 10 %
VDD = 3.3 V +/- 10 %
VDD = 5.0 V +/- 10 %
V() = 0...VDD - 1 V
Vpu() = VDD - V(), I() = -3 µA
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