LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | BROADSIDE VERSION OF 373 |
| 系列 | LVT |
| JESD-30 代码 | R-GDFP-F20 |
| 长度 | 13.09 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 最大电源电流（ICC） | 5 mA |
| 传播延迟（tpd） | 5.4 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.92 mm |
| SN54LVTH573W | SN74LVTH573DGVR | SN54LVTH573FK | SN54LVTH573J | SN54LVTH573WR | |
|---|---|---|---|---|---|
| 描述 | LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | LVT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 |
| 包装说明 | DFP, | TSSOP, TSSOP20,.25,16 | QCCN, | DIP, | DFP, |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown | unknown |
| 其他特性 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 | BROADSIDE VERSION OF 373 |
| 系列 | LVT | LVT | LVT | LVT | LVT |
| JESD-30 代码 | R-GDFP-F20 | R-PDSO-G20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 |
| 长度 | 13.09 mm | 5 mm | 8.89 mm | 24.195 mm | 13.09 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | TSSOP | QCCN | DIP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | IN-LINE | FLATPACK |
| 最大电源电流（ICC） | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA |
| 传播延迟（tpd） | 5.4 ns | 4.9 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 1.2 mm | 2.03 mm | 5.08 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | NO | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | GULL WING | NO LEAD | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 0.4 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 6.92 mm | 4.4 mm | 8.89 mm | 7.62 mm | 6.92 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP | - | QLCC | DIP | DFP |
| 针数 | 20 | - | 20 | 20 | 20 |
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