LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, PQCC28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | QCCJ, |
| Reach Compliance Code | unknown |
| 其他特性 | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD |
| 系列 | LS |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 长度 | 11.5062 mm |
| 逻辑集成电路类型 | ARITHMETIC LOGIC UNIT |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 62 ns |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.5062 mm |
| SN74LS181FN | SN74LS181DW | SN54LS181W | SN54LS181FK | SN74LS181J | SN54181J | SNJ54181J | SN54181W | SNJ54181W | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, PQCC28 | LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, PDSO24 | Arithmetic Logic Unit, LS Series, 4-Bit, TTL, CDFP24 | Arithmetic Logic Unit, LS Series, 4-Bit, TTL, CQCC28 | LS SERIES, 4-BIT ARITHMETIC LOGIC UNIT, CDIP24 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP24 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDIP24 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDFP24 | Arithmetic Logic Unit, TTL/H/L Series, 4-Bit, TTL, CDFP24, HERMETIC SEALED, CERAMIC, FP-24 |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, | SOP, | DFP, | QCCN, | DIP, | DIP, | DIP, | DFP, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD | CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD |
| 系列 | LS | LS | LS | LS | LS | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
| JESD-30 代码 | S-PQCC-J28 | R-PDSO-G24 | R-CDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDFP-F24 | R-GDFP-F24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 28 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCJ | SOP | DFP | QCCN | DIP | DIP | DIP | DFP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟（tpd） | 62 ns | 62 ns | 62 ns | 62 ns | 62 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 认证状态 | COMMERCIAL | COMMERCIAL | Not Qualified | Not Qualified | COMMERCIAL | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | Rochester Electronics | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 长度 | 11.5062 mm | 15.4 mm | 14.36 mm | 11.43 mm | - | - | - | 14.36 mm | - |
| 座面最大高度 | 4.57 mm | 2.65 mm | 2.29 mm | 2.03 mm | - | - | - | 2.29 mm | 2.16 mm |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - | - | 1.27 mm | 1.27 mm |
| 宽度 | 11.5062 mm | 7.5 mm | 9.09 mm | 11.43 mm | - | - | - | 9.09 mm | 9.3 mm |
stm32/stm8
RF/无线
嵌入式系统
嵌入式系统
51单片机
模拟电子
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