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351B
PRELIMINARY
CY7C1351B
128Kx36 Flow-Through SRAM with NoBL™ Architecture
Features
•
Pin compatible and functionally equivalent to ZBT™ de-
vices IDT71V547, MT55L128L36F, and MCM63Z737
• Supports 66-MHz bus operations with zero wait states
— Data is transferred on every clock
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for Flow-Through operation
• Byte Write capability
• 128K x 36 common I/O architecture
• Single 3.3V power supply
• Fast clock-to-output times
— 7.5 ns (for 117-MHz device)
— 8.5 ns (for 100-MHz device)
— 11.0 ns (for 66-MHz device)
— 12.0 ns (for 50-MHz device)
•
•
•
•
•
— 14.0 ns (for 40-MHz device)
Clock Enable (CEN) pin to suspend operation
Synchronous self-timed writes
Asynchronous Output Enable
Standard 100 TQFP and 119 BGA packages
Burst Capability—linear or interleaved burst order
Low standby power
Functional Description
The CY7C1351B is a 3.3V, 128K by 36 Synchronous
Flow-Through Burst SRAM designed specifically to support
unlimited true back-to-back Read/Write operations without the
insertion of wait states. The CY7C1351B is equipped with the
advanced No Bus Latency™ (NoBL™) logic required to en-
able consecutive Read/Write operations with data being trans-
ferred on every clock cycle. This feature dramatically improves
the throughput of data through the SRAM, especially in sys-
tems that require frequent Write/Read transitions. The
CY7C1351B is pin/functionally compatible to ZBT SRAMs
IDT71V547, MT55L128L36F, and MCM63Z737.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock.The clock input is qualified by
the Clock Enable (CEN) signal, which, when deasserted, sus-
pends operation and extends the previous clock cycle. Maxi-
mum access delay from the clock rise is 7.5 ns (117-MHz
device).
Write operations are controlled by the four Byte Write Select
(BWS
[3:0]
) and a Write Enable (WE) input. All writes are con-
ducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank se-
lection and output three-state control. In order to avoid bus
contention, the output drivers are synchronously three-stated
during the data portion of a write sequence.
Logic Block Diagram
CLK
D
Data-In REG.
CE Q
36
17
CONTROL
and WRITE
LOGIC
17
128KX36
MEMORY
ARRAY
36
DQ
[31:0]
DP
[3:0]
36
ADV/LD
A
[16:0]
CEN
CE
1
CE
2
CE
3
WE
BWS [3:0]
Mode
OE
.
Selection Guide
7C1351B-117 7C1351B-100
Maximum Access Time (ns)
Maximum Operating Current
(mA)
Maximum CMOS Standby
Current (mA)
Commercial
Commercial
7.5
375 mA
5 mA
8.5
350 mA
5 mA
7C1351B-66
11.0
250 mA
5 mA
7C1351B-50 7C1351B-40
12.0
200 mA
5 mA
14.0
175 mA
5 mA
Cypress Semiconductor Corporation
Document #: 38-05208 Rev. *A
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised November 19, 2002
PRELIMINARY
Pin Configuration
100-Pin TQFP
ADV/LD
BWS
3
BWS
2
BWS
1
BWS
0
CE
1
CE
2
CE
3
V
DD
V
SS
CEN
CLK
WE
OE
NC
A6
A7
NC
A
8
A
9
81
CY7C1351B
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
DP
2
DQ
16
DQ
17
V
DDQ
V
SS
DQ
18
DQ
19
DQ
20
DQ
21
V
SS
V
DDQ
DQ
22
DQ
23
V
SS
V
DD
V
DD
V
SS
DQ
24
DQ
25
V
DDQ
V
SS
DQ
26
DQ
27
DQ
28
DQ
29
V
SS
V
DDQ
DQ
30
DQ
31
DP
3
100
82
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
80
79
78
77
76
75
74
73
72
71
70
DP
1
DQ
15
DQ
14
V
DDQ
V
SS
DQ
13
DQ
12
DQ
11
DQ
10
V
SS
V
DDQ
DQ
9
DQ
8
V
SS
V
SS
V
DD
V
SS
DQ
7
DQ
6
V
DDQ
V
SS
DQ
5
DQ
4
DQ
3
DQ
2
V
SS
V
DDQ
DQ
1
DQ
0
DP
0
CY7C1351B
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
A
16
DNU
DNU
A
5
A
4
A
3
A
2
A
1
A
0
A
11
A
12
A
13
V
SS
MODE
V
DD
Document #: 38-05208 Rev. *A
DNU
DNU
A
10
A
14
A
15
Page 2 of 16
PRELIMINARY
Pin Configuration
119-Ball Bump BGA
CY7C1351B (128K x 36) - 7 x 17 BGA
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
DDQ
NC
NC
DQ
c
DQ
c
V
DDQ
DQ
c
DQ
c
V
DDQ
DQ
d
DQ
d
V
DDQ
DQ
d
DQ
d
NC
NC
V
DDQ
CY7C1351B
2
A
CE
2
A
DP
c
DQ
c
DQ
c
DQ
c
DQ
c
V
DD
DQ
d
DQ
d
DQ
d
DQ
d
DP
d
A
64M
TMS
3
A
A
A
V
SS
V
SS
V
SS
BWS
c
V
SS
V
SS(1)
V
SS
BWS
d
V
SS
V
SS
V
SS
MODE
A
TDI
4
16M
ADV/LD
V
DD
NC
CE
1
OE
8M
WE
V
DD
CLK
NC
CEN
A1
A0
V
DD
A
TCK
5
A
A
A
V
SS
V
SS
V
SS
BWS
b
V
SS
V
SS(1)
V
SS
BWS
a
V
SS
V
SS
V
SS
V
SS
A
TDO
6
A
CE
3
A
DP
b
DQ
b
DQ
b
DQ
b
DQ
b
V
DD
DQ
a
DQ
a
DQ
a
DQ
a
DP
a
A
32M
DNU
7
V
DDQ
NC
NC
DQ
b
DQ
b
V
DDQ
DQ
b
DQ
b
V
DDQ
DQ
a
DQ
a
V
DDQ
DQ
a
DQ
a
NC
NC
V
DDQ
Document #: 38-05208 Rev. *A
Page 3 of 16
PRELIMINARY
Pin Definitions
Name
A
[16:0]
BWS
[3:0]
I/O
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Description
CY7C1351B
Address Inputs used to select one of the 133,072 address locations.
Sampled at the rising
edge of the CLK.
Byte Write Select Inputs, active LOW.
Qualified with WE to conduct writes to the SRAM.
Sampled on the rising edge of CLK. BWS
0
controls DQ
[7:0]
and DP
0
, BWS
1
controls DQ
[15:8]
and DP
1
, BWS
2
controls DQ
[23:16]
and DP
2
, BWS
3
controls DQ
[31:24]
and DP
3
.
Write Enable Input, active LOW.
Sampled on the rising edge of CLK if CEN is active LOW.
This signal must be asserted LOW to initiate a write sequence.
Advance/Load input used to advance the on-chip address counter or load a new ad-
dress.
When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When
LOW, a new address can be loaded into the device for an access. After being deselected,
ADV/LD should be driven LOW in order to load a new address.
Clock Input.
Used to capture all synchronous inputs to the device. CLK is qualified with CEN.
CLK is only recognized if CEN is active LOW.
Chip Enable 1 Input, active LOW.
Sampled on the rising edge of CLK. Used in conjunction
with CE
2
and CE
3
to select/deselect the device.
Chip Enable 2 Input, active HIGH.
Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and CE
3
to select/deselect the device.
Chip Enable 3 Input, active LOW.
Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and CE
2
to select/deselect the device.
Output Enable, active LOW.
Combined with the synchronous logic block inside the device to
control the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as outputs.
When deasserted HIGH, I/O pins are three-stated, and act as input data pins. OE is masked
during the data portion of a write sequence, during the first clock when emerging from a
deselected state and when the device has been deselected.
Clock Enable Input, active LOW.
When asserted LOW the clock signal is recognized by the
SRAM. When deasserted HIGH the clock signal is masked. Since deasserting CEN does not
deselect the device, CEN can be used to extend the previous cycle when required.
Bidirectional Data I/O Lines.
As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by A
[16:0]
during the previous clock rise of the read cycle. The direction of the pins is
controlled by OE and the internal control logic. When OE is asserted LOW, the pins can behave
as outputs. When HIGH, DQ
[31:0]
are placed in a three-state condition. The outputs are auto-
matically three-stated during the data portion of a write sequence, during the first clock when
emerging from a deselected state, and when the device is deselected, regardless of the state
of OE.
Bidirectional Data Parity I/O Lines.
Functionally, these signals are identical to DQ
[31:0]
. Dur-
ing write sequences, DP
0
is controlled by BWS
0
, DP
1
is controlled by BWS
1
, DP
2
is controlled
by BWS
2
, and DP
3
is controlled by BWS
3
.
Mode Input.
Selects the burst order of the device. Tied HIGH selects the interleaved burst
order. Pulled LOW selects the linear burst order. MODE should not change states during
operation. When left floating MODE will default HIGH, to an interleaved burst order.
Power supply inputs to the core of the device.
Should be connected to 3.3V power supply.
Power supply for the I/O circuitry.
Should be connected to a 3.3V power supply.
Ground for the device.
Should be connected to ground of the system.
No Connects.
Reserved for address inputs for depth expansion. Pins 83 and 84 will be used
for 256K and 512K depths respectively.
Do Not Use pins.
These pins should be left floating or tied to V
SS
.
WE
ADV/LD
CLK
CE
1
CE
2
CE
3
OE
Input-Clock
Input-
Synchronous
Input-
Synchronous
Input-
Synchronous
Input-
Asynchronous
CEN
Input-
Synchronous
I/O-
Synchronous
DQ
[31:0]
DP
[3:0]
I/O-
Synchronous
Input
Strap pin
Power Supply
I/O Power
Supply
Ground
-
-
MODE
V
DD
V
DDQ
V
SS
NC
DNU
Document #: 38-05208 Rev. *A
Page 4 of 16
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