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CY7C1310V18-167BZC

产品描述QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
产品类别存储    存储   
文件大小443KB,共25页
制造商Cypress(赛普拉斯)
下载文档 详细参数 选型对比 全文预览

CY7C1310V18-167BZC概述

QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165

CY7C1310V18-167BZC规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Cypress(赛普拉斯)
零件包装代码BGA
包装说明TBGA, BGA165,11X15,40
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间0.5 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)167 MHz
I/O 类型SEPARATE
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度16777216 bit
内存集成电路类型QDR SRAM
内存宽度8
湿度敏感等级3
功能数量1
端子数量165
字数2097152 words
字数代码2000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)220
电源1.5/1.8,1.8 V
认证状态Not Qualified
座面最大高度1.2 mm
最小待机电流1.7 V
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm

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PRELIMINARY
CY7C1310V18
CY7C1312V18
CY7C1314V18
18-Mb QDR™-II SRAM Two-word
Burst Architecture
Features
• Separate Independent Read and Write Data Ports
— Supports concurrent transactions
• 167-MHz Clock for High Bandwidth
• Two-word Burst on all accesses
• Double Data Rate (DDR) interfaces on both Read & Write
Ports (data transferred at 333 MHz) @ 167MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two output clocks (C and C) accounts for clock skew
and flight time mismatches
• Echo clocks (CQ and CQ) simplify data capture in high
speed systems
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x8, x18, and x36 configurations
• 1.8V core power supply with HSTL Inputs and Outputs
• 13x15 mm 1.0-mm pitch FBGA package, 165 ball (11x15
matrix)
• Variable drive HSTL output buffers
• Extended HSTL output voltage (1.4V–V
DD
)
• JTAG Interface
• On-chip Delay Lock Loop (DLL)
Functional Description
The CY7C1310V18/CY7C1312V18/CY7C1314V18 are 1.8V
Synchronous Pipelined SRAMs, equipped with QDR
-II archi-
tecture. QDR
TM
-II architecture consists of two separate ports
to access the memory array. The Read port has dedicated
Data Outputs to support Read operations and the Write Port
has dedicated Data Inputs to support Write operations.
QDR
TM
-II architecture has separate data inputs and data
outputs to completely eliminate the need to “turn-around” the
data bus required with common I/O devices. Access to each
port is accomplished through a common address bus. The
Read address is latched on the rising edge of the K clock and
the Write address is latched on the rising edge of the K clock.
Accesses to the QDR
TM
-II Read and Write ports are
completely independent of one another. In order to maximize
data throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with two 8-bit words (CY7C1310V18) or 18-bit
words (CY7C1312V18) or 36-bit words (CY7C1314V18) that
burst sequentially into or out of the device. Since data can be
transferred into and out of the device on every rising edge of
both input clocks (K/K and C/C), memory bandwidth is
maximized while simplifying system design by eliminating bus
“turn-arounds.”
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C/C (or K/K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Configurations
CY7C1310V18 – 2M x 8
CY7C1312V18 – 1M x 18
CY7C1314V18 – 512K x 36
Logic Block Diagram (CY7C1310V18)
D
[7:0]
8
Write
Reg
1M x 8 Array
Write Add. Decode
20
Read Add. Decode
A
(19:0)
Address
Register
Write
Reg
1M x 8 Array
Address
Register
20
A
(19:0)
K
K
CLK
Gen.
Control
Logic
RPS
C
C
Read Data Reg.
16
Control
Logic
8
Reg.
8
Reg.
8
Reg.
CQ
CQ
V
REF
WPS
BWS
[1:0]
8
8
Q
[7:0]
Cypress Semiconductor Corporation
Document #: 38-05180 Rev. *A
3901 North First Street
San Jose
CA 95134 • 408-943-2600
Revised August 2, 2002

CY7C1310V18-167BZC相似产品对比

CY7C1310V18-167BZC CY7C1310V18-133BZC CY7C1310V18-200BZC CY7C1314V18-200BZC CY7C1312V18-200BZC
描述 QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 2MX8, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 512KX36, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 1MX18, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
是否无铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
零件包装代码 BGA BGA BGA BGA BGA
包装说明 TBGA, BGA165,11X15,40 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
针数 165 165 165 165 165
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 0.5 ns - - 0.38 ns 0.38 ns
其他特性 PIPELINED ARCHITECTURE - - PIPELINE ARCHITECTURE PIPELINE ARCHITECTURE
最大时钟频率 (fCLK) 167 MHz - - 200 MHz 200 MHz
I/O 类型 SEPARATE - - SEPARATE SEPARATE
JESD-30 代码 R-PBGA-B165 - - R-PBGA-B165 R-PBGA-B165
JESD-609代码 e0 - - e0 e0
长度 15 mm - - 15 mm 15 mm
内存密度 16777216 bit - - 18874368 bit 18874368 bit
内存集成电路类型 QDR SRAM - - QDR SRAM QDR SRAM
内存宽度 8 - - 36 18
湿度敏感等级 3 - - 3 3
功能数量 1 - - 1 1
端子数量 165 - - 165 165
字数 2097152 words - - 524288 words 1048576 words
字数代码 2000000 - - 512000 1000000
工作模式 SYNCHRONOUS - - SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C - - 70 °C 70 °C
组织 2MX8 - - 512KX36 1MX18
输出特性 3-STATE - - 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TBGA - - TBGA TBGA
封装等效代码 BGA165,11X15,40 - - BGA165,11X15,40 BGA165,11X15,40
封装形状 RECTANGULAR - - RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE - - GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
并行/串行 PARALLEL - - PARALLEL PARALLEL
峰值回流温度(摄氏度) 220 - - 220 220
电源 1.5/1.8,1.8 V - - 1.5/1.8,1.8 V 1.5/1.8,1.8 V
认证状态 Not Qualified - - Not Qualified Not Qualified
座面最大高度 1.2 mm - - 1.2 mm 1.2 mm
最小待机电流 1.7 V - - 1.7 V 1.7 V
最大供电电压 (Vsup) 1.9 V - - 1.9 V 1.9 V
最小供电电压 (Vsup) 1.7 V - - 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V - - 1.8 V 1.8 V
表面贴装 YES - - YES YES
技术 CMOS - - CMOS CMOS
温度等级 COMMERCIAL - - COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL - - BALL BALL
端子节距 1 mm - - 1 mm 1 mm
端子位置 BOTTOM - - BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED
宽度 13 mm - - 13 mm 13 mm
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