64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.200 INCH, PLASTIC, SO-8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | SOIC |
包装说明 | 0.200 INCH, PLASTIC, SO-8 |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最大时钟频率 (fCLK) | 0.4 MHz |
数据保留时间-最小值 | 40 |
耐久性 | 100000 Write/Erase Cycles |
I2C控制字节 | 1010DDDR |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 5.3 mm |
内存密度 | 524288 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -20 °C |
组织 | 64KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 2.03 mm |
串行总线类型 | I2C |
最大待机电流 | 0.00001 A |
最大压摆率 | 0.002 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 5.25 mm |
最长写入周期时间 (tWC) | 10 ms |
写保护 | HARDWARE |
M24512-MW5T | M24512-WMW5T | M24512-SLA5T | M24512-LA6T | M24512-SMW5T | M24512-MW6T | M24512-LA5T | M24512-WLA5T | M24512-WLA6T | |
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描述 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.200 INCH, PLASTIC, SO-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.200 INCH, PLASTIC, SO-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LGA-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LGA-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.200 INCH, PLASTIC, SO-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.200 INCH, PLASTIC, SO-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LGA-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LGA-8 | 64KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, LGA-8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | 0.200 INCH, PLASTIC, SO-8 | SOP, SOP8,.3 | LGA-8 | LGA-8 | 0.200 INCH, PLASTIC, SO-8 | 0.200 INCH, PLASTIC, SO-8 | LGA-8 | LGA-8 | LGA-8 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | not_compliant | not_compliant | not_compliant | unknown | unknown | not_compliant | not_compliant | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 5.3 mm | 5.3 mm | 8 mm | 8 mm | 5.3 mm | 5.3 mm | 8 mm | 8 mm | 8 mm |
内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bi |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -40 °C | -20 °C | -40 °C | -20 °C | -20 °C | -40 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | SON | SON | SOP | SOP | SON | SON | SON |
封装等效代码 | SOP8,.3 | SOP8,.3 | SOLCC8,.3 | SOLCC8,.3 | SOP8,.3 | SOP8,.3 | SOLCC8,.3 | SOLCC8,.3 | SOLCC8,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 5 V | 3/5 V | 2/3.3 V | 5 V | 2/3.3 V | 5 V | 5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.03 mm | 2.03 mm | 1.14 mm | 1.14 mm | 2.03 mm | 2.03 mm | 1.14 mm | 1.14 mm | 1.14 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大待机电流 | 0.00001 A | 0.000002 A | 0.000001 A | 0.00001 A | 0.000001 A | 0.00001 A | 0.00001 A | 0.000002 A | 0.000002 A |
最大压摆率 | 0.002 mA | 0.001 mA | 0.0008 mA | 0.002 mA | 0.0008 mA | 0.002 mA | 0.002 mA | 0.001 mA | 0.001 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 3.6 V | 5.5 V | 3.6 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 2.5 V | 1.8 V | 4.5 V | 1.8 V | 4.5 V | 4.5 V | 2.5 V | 2.5 V |
标称供电电压 (Vsup) | 5 V | 3.3 V | 2.5 V | 5 V | 2.5 V | 5 V | 5 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 5.25 mm | 5.25 mm | 5 mm | 5 mm | 5.25 mm | 5.25 mm | 5 mm | 5 mm | 5 mm |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
厂商名称 | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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