电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

GS8170DW18GC-300IT

产品描述Standard SRAM, 1MX18, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
产品类别存储    存储   
文件大小907KB,共36页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
标准  
下载文档 详细参数 全文预览

GS8170DW18GC-300IT概述

Standard SRAM, 1MX18, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS8170DW18GC-300IT规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称GSI Technology
零件包装代码BGA
包装说明LBGA,
针数209
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间5.5 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B209
JESD-609代码e1
长度22 mm
内存密度18874368 bit
内存集成电路类型STANDARD SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量209
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX18
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.7 mm
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm

文档预览

下载PDF文档
Preliminary
GS8170DW18/36/72C-333/300/250
209-Bump BGA
Commercial Temp
Industrial Temp
18Mb
Σ1x1
Double Late Write
SigmaRAM™ SRAM
250 MHz–333 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Features
• Double Late Write mode
• JEDEC-standard SigmaRAM
pinout and package
• 1.8 V +150/–100 mV core power supply
• 1.5 V or 1.8 V I/O supply
• Dual Cycle Deselect
• Synchronous Burst operation
• Fully coherent read and write pipelines
• Echo Clock outputs track data output drivers
• ZQ mode pin for user-selectable output drive strength
• Byte write operation (9-bit bytes)
• 2 user-programmable chip enable inputs for easy depth
expansion
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
- 333
3.0 ns
1.6 ns
Bottom View
209-Bump, 14 mm x 22 mm BGA
1 mm Bump Pitch, 11 x 19 Bump Array
Pipeline mode
tKHKH
tKHQV
SigmaRAM Family Overview
GS8170DW18/36/72 SigmaRAMs (ΣRAM
™)
are built in
compliance with the
ΣRAM
pinout standard for synchronous
SRAMs. They are 18,874,368-bit (18Mb) SRAMs. These are
the first in a family of wide, very low voltage CMOS I/O
SRAMs designed to operate at the speeds needed to implement
economical high performance networking systems.
GSI's
ΣRAMs
are offered in a number of configurations that
emulate other synchronous SRAMs, such as Burst RAMs,
NBT, Late Write, or Double Data Rate (DDR) SRAMs. The
logical differences between the protocols employed by these
RAMs hinge mainly on various combinations of address
bursting, output data registering and write cueing. The
ΣRAM
family standard allows a user to implement the interface
protocol best suited to the task at hand.
Functional Description
Because
ΣRAMs
are synchronous devices, address, data
inputs, and read/write control inputs are captured on the rising
edge of the input clock. Write cycles are internally self-timed
and initiated by the rising edge of the clock input. This feature
eliminates complex off-chip write pulse generation required by
asynchronous SRAMs and simplifies input signal timing.
The GS8170DW18/36/72C is configured to read in Pipeline
mode. In Pipeline mode, single data rate
ΣRAMs
incorporate a
rising-edge-triggered output register. For read cycles, a
pipelined SRAM’s output data is staged at the input of an edge-
triggered output register during the access cycle and then
released to the output drivers at the next rising edge of clock.
GS8170DW18/36/72C
ΣRAMs
are implemented with GSI's
high performance CMOS technology and are packaged in a
209-bump BGA.
Rev: 1.00d 6/2002
1/36
© 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.

热门活动更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1204  523  2019  2848  1463  25  11  41  58  30 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved