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82562EP

产品描述 82562EP 10/100 Mbps Platform LAN Connect (PLC)
产品类别无线/射频/通信    电信电路   
文件大小232KB,共24页
制造商Intel(英特尔)
官网地址http://www.intel.com/
下载文档 详细参数 选型对比 全文预览

82562EP概述

82562EP 10/100 Mbps Platform LAN Connect (PLC)

82562EP规格参数

参数名称属性值
厂商名称Intel(英特尔)
零件包装代码BGA
包装说明PLASTIC, BGA-64
针数64
Reach Compliance Codecompli
Is SamacsysN
JESD-30 代码S-PBGA-B64
长度8 mm
功能数量1
端子数量64
最高工作温度85 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装形状SQUARE
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
认证状态Not Qualified
座面最大高度1.2 mm
标称供电电压3.3 V
表面贴装YES
电信集成电路类型INTERFACE CIRCUIT
温度等级OTHER
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
宽度8 mm
Base Number Matches1

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下载PDF文档
82562EP 10/100 Mbps Platform LAN
Connect (PLC)
Networking Silicon
Datasheet
Product Features
IEEE 802.3 10BASE-T/100BASE-TX
compliant physical layer interface
IEEE 802.3u Auto-Negotiation support
Digital Adaptive Equalization control
Link status interrupt capability
XOR tree mode support
3-port LED support (speed, link and
activity)
10BASE-T auto-polarity correction
Alert on LAN functionality
Diagnostic loopback mode
1:1 transmit transformer ratio support
Low power (less than 300 mW in active
transmit mode)
Reduced power in “unplugged mode” (less
than 50 mW)
Automatic detection of “unplugged mode”
3.3 V device
Lead-free
1
64-pin Plastic Ball Grid Array
Package for both leaded and lead-free
designs. (Devices that are lead-free are
marked with a circled “e1” and have the
product code prefix: PCxxxxxx).
This device is lead-free. That is, lead has not been intentionally added, but lead may still exist
as an impurity at <1000 ppm. The Material Declaration Data Sheet, which includes lead
impurity levels and the concentration of other Restriction on Hazardous Substances (RoHS)-
banned materials, is available at:
ftp://download.intel.com/design/packtech/material_content_IC_Package.pdf#pagemode=bookmarks
1
In addition, this device has been tested and conforms to the same parametric specifications as
previous versions of the device.
For more information regarding lead-free products from Intel Corporation, contact your Intel
Field Sales representative.
Revision 2.0
September 2005

82562EP相似产品对比

82562EP PC82562EP RC82562EP
描述 82562EP 10/100 Mbps Platform LAN Connect (PLC) 82562EP 10/100 Mbps Platform LAN Connect (PLC) 82562EP 10/100 Mbps Platform LAN Connect (PLC)
厂商名称 Intel(英特尔) Intel(英特尔) Intel(英特尔)
Reach Compliance Code compli unknow compli
Is Samacsys N N N
JESD-30 代码 S-PBGA-B64 S-PBGA-B64 S-PBGA-B64
端子数量 64 64 64
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA FBGA FBGA
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified
标称供电电压 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
端子形式 BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1
零件包装代码 BGA BGA -
包装说明 PLASTIC, BGA-64 - FBGA, BGA64,8X8,32
是否Rohs认证 - 符合 不符合
封装等效代码 - BGA64,8X8,32 BGA64,8X8,32
电源 - 3.3 V 3.3 V
uPs/uCs/外围集成电路类型 - SERIAL IO/COMMUNICATION CONTROLLER, LAN SERIAL IO/COMMUNICATION CONTROLLER, LAN

 
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