EEPROM, 16KX8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.1 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.4 mm |
| 内存密度 | 131072 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 6 ms |

| FM24C128LMT8X | FM24C128FN | FM24C128LVMW8 | FM24C128MW8 | FM24C128FLMT8 | FM24C128FLMW8 | FM24C128N | FM24C128LN | FM24C128LMW8 | FM24C128LMT8 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 16KX8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 16KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 16KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16KX8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | 16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8 | 16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | 16KX8 I2C/2-WIRE SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 | 16KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16KX8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 |
| 零件包装代码 | SOIC | DIP | SOIC | SOIC | SOIC | SOIC | DIP | DIP | SOIC | SOIC |
| 包装说明 | TSSOP, | DIP, | SOP, | SOP, | PLASTIC, TSSOP-8 | PLASTIC, SOIC-8 | DIP, | PLASTIC, DIP-8 | PLASTIC, SOIC-8 | TSSOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最大时钟频率 (fCLK) | 0.1 MHz | 0.4 MHz | 0.1 MHz | 0.1 MHz | 0.4 MHz | 0.4 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.4 mm | 9.817 mm | 4.9 mm | 4.9 mm | 4.4 mm | 4.9 mm | 9.817 mm | 9.817 mm | 4.9 mm | 4.4 mm |
| 内存密度 | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | DIP | SOP | SOP | TSSOP | SOP | DIP | DIP | SOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | COMMERCIAL | Not Qualified | COMMERCIAL | COMMERCIAL | Not Qualified |
| 座面最大高度 | 1.2 mm | 5.08 mm | 1.75 mm | 1.75 mm | 1.2 mm | 1.75 mm | 5.08 mm | 5.08 mm | 1.75 mm | 1.2 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 4.5 V | 2.5 V | 4.5 V | 2.5 V | 2.5 V | 4.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3 mm | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3 mm |
| 最长写入周期时间 (tWC) | 6 ms | 6 ms | 6 ms | 6 ms | 6 ms | 6 ms | 6 ms | 6 ms | 6 ms | 6 ms |
| 厂商名称 | Rochester Electronics | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | - | - | EAR99 |
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