Pb Free Product
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NCEP15T11D
NCE N-Channel
Super Trench
Power MOSFET
Description
The NCEP15T11D uses
Super Trench
technology that is
uniquely optimized to provide the most efficient high frequency
switching performance. Both conduction and switching power
losses are minimized due to an extremely low combination of
R
DS(ON)
and Q
g
. This device is ideal for high-frequency
switching and synchronous rectification.
General Features
●
VDS =150V,ID =110A
RDS(ON) <7.8mΩ @ VGS=10V
●
Excellent gate charge x RDS(on) product(FOM)
●
Very low on-resistance RDS(on)
●
175 °C operating temperature
●
Pb-free lead plating
●
100% UIS tested
Schematic diagram
TO-263-2L top view
Application
●
DC/DC Converter
●
Ideal for high-frequency switching and synchronous
rectification
100% UIS TESTED!
100%
∆Vds
TESTED!
Package Marking and Ordering Information
Device Marking
NCEP15T11D
Device
NCEP15T11D
Device Package
TO-263-2L
Reel Size
-
Tape width
-
Quantity
-
Absolute Maximum Ratings (T
C
=25℃unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous
Drain Current-Continuous(T
C
=100
℃
)
Pulsed Drain Current
Maximum Power Dissipation
Derating factor
Single pulse avalanche energy
(Note 5)
Operating Junction and Storage Temperature Range
E
AS
Symbol
V
DS
V
GS
I
D
I
D
(100℃)
Limit
150
±20
110
93
440
300
2
1296
-55 To 175
Unit
V
V
A
A
A
W
W/℃
mJ
℃
I
DM
P
D
T
J
,T
STG
Thermal Characteristic
Thermal Resistance,Junction-to-Case
(Note 2)
R
θJC
0.5
℃
/W
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Electrical Characteristics (T
C
=25℃unless otherwise noted)
Parameter
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics
(Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics
(Note4)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
(Note 4)
Turn-on Delay Time
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Drain-Source Diode Characteristics
Diode Forward Voltage
(Note 3)
Diode Forward Current
(Note 2)
Reverse Recovery Time
Reverse Recovery Charge
V
SD
I
S
t
rr
Qrr
T
J
= 25°C, I
F
= I
S
di/dt = 100A/μs
(Note3)
NCEP15T11D
Condition
V
GS
=0V I
D
=250μA
V
DS
=150V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
V
DS
=V
GS
,I
D
=250μA
V
GS
=10V, I
D
=55A
V
DS
=10V,I
D
=55A
Symbol
BV
DSS
I
DSS
I
GSS
V
GS(th)
R
DS(ON)
g
FS
C
lss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Min
150
-
-
2.5
-
70
-
-
-
-
Typ
147
-
-
-
6
-
10000
2046
55
30
52
69
21
150
50
26
Max
-
1
±100
4.5
7.8
-
-
-
-
-
-
-
-
Unit
V
μA
nA
V
mΩ
S
PF
PF
PF
nS
nS
nS
nS
nC
nC
nC
V
DS
=75V,V
GS
=0V,
F=1.0MHz
V
DD
=75V,I
D
=55A
V
GS
=10V,R
G
=4.7Ω
-
-
-
-
-
-
-
-
-
-
V
DS
=75V,I
D
=55A,
V
GS
=10V
V
GS
=0V,I
F
= I
S
1.2
-
140
498
110
V
A
nS
nC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t
≤
10 sec.
3. Pulse Test: Pulse Width
≤
300μs, Duty Cycle
≤
2%.
4. Guaranteed by design, not subject to production
5. EAS condition : Tj=25
℃
,V
DD
=50V,V
G
=10V,L=0.5mH,Rg=25Ω
Wuxi NCE Power Semiconductor Co., Ltd
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NCEP15T11D
Test Circuit
1) E
AS
test Circuit
2) Gate charge test Circuit
3) Switch Time Test Circuit
Wuxi NCE Power Semiconductor Co., Ltd
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Typical Electrical and Thermal Characteristics
Normalized On-Resistance
NCEP15T11D
I
D
- Drain Current (A)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 1 Output Characteristics
Figure 4 Rdson-JunctionTemperature
Vgs Gate-Source Voltage (V)
Vgs Gate-Source Voltage (V)
I
D
- Drain Current (A)
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Rdson On-Resistance(mΩ)
Figure 5 Gate Charge
I
D
- Drain Current (A)
I
s
- Reverse Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson-
Drain Current
Figure 6 Source- Drain Diode Forward
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NCEP15T11D
C Capacitance (pF)
Power Dissipation (W)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 7 Capacitance vs Vds
Figure 9 Power De-rating
I
D
- Drain Current (A)
I
D
- Drain Current (A)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 8 Safe Operation Area
Figure 10 Current De-rating
r(t),Normalized Effective
Transient Thermal Impedance
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
Wuxi NCE Power Semiconductor Co., Ltd
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