MADP-000504-10720T
Non Magnetic MELF PIN Diode
Features
•
•
•
•
•
•
•
High Power Handling
Low Loss / Low Distortion
Leadless Low Inductance MELF Package
Non-Magnetic
Surface Mountable
RoHS Compliant
MSL 1
V1
Package Style 1072
Dot Denotes Cathode
Description
M/A-COM Technology Solutions product line of
MELF, PIN diodes, encompass a comprehensive
range of electrical characteristics. The chip used in
the MADP-000504-10720T is manufactured using
a unique, CERMACHIP, passivation process which
provides for a hard glass encapsulation that
protects and hermetically seals the active area of
the chip. This packaged, CERMACHIP, PIN diode
is ideally suited for use in applications where high
RF and DC voltages are present.
The chip is enclosed in a rugged, ceramic, Metal
Electrode Leadless Faced (MELF), surface mount
package that is full face bonded to refractory metal
plugs on both the anode and cathode. The result is
a low loss PIN diode with low thermal resistance
due to its symmetrical thermal paths. MELF PIN
diodes are designed specifically for high volume
tape and reel assembly. Their user friendly design
provides for extremely easy, automatic, pick and
place, indexing and assembly. All solderable
surfaces are tin plated and are compatible with all
industry standard reflow and vapor phase soldering
processes.
Absolute Maximum Ratings @ 25°C
Parameter
Forward Voltage
1,2
Reverse Voltage
1,2
Operating Temperature
Storage Temperature
Mounting Temperature
Absolute Maximum
1.0 V
500V
-65°C to +175°C
-65°C to +200°C
+260°C for 30 seconds
1. Exceeding these limits may cause permanent damage
to the device.
2. Values will de-rate linearly over temperature.
Applications
The MADP-000504-10720T MELF is well suited for
use in low loss, low distortion, UHF and VHF high
power switching circuits. It is specifically designed to
operate in high magnetic fields and to tune or protect
RF coils in MRI circuits. This device is designed to
meet the most demanding electrical and mechanical
environments.
Ordering Information
Part Number
MADP-000504-10720T
Packaging
Quantity
Tape and reel 1500 pcs
Tape and reel information can be found in Application
Note
M513
on the M/A-COM website
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
Electrical Specifications @ T
A
= +25°C
Parameters
Symbols
Conditions
Units
Min.
Typ.
Max.
V1
Total Capacitance
1
Package Capacitance
Series Resistance
Minority Carrier Lifetime
Forward Voltage
Reverse Leakage Current
Thermal Resistance
2
Power Dissipation
2,3
Thermal Resistance
4
Power Dissipation
4,5
C
T100V
C
p
R
S
T
L
V
F
-I
R
θ
Pd
θ
Pd
—
IIP3
-100 V @ 1 MHz
—
+100 mA @ 100 MHz
I
F
= +10 mA / I
R
= -6 mA
+ 50 mA
-500 V
—
—
—
—
—
Power In = +10dBm
Freq. = 1000 MHz
Spacing = 1 MHz
pF
pF
Ω
µS
V
nA
°C/W
W
°C/W
W
µm
dBm
—
—
—
—
—
—
—
—
—
0.16
—
1.0
—
—
16
—
48
—
44
0.50
0.60
—
1.0
| -100 |
20
7.5
51
2.9
I Region Thickness
3rd Order
Input Intermodulation Distortion
1.
2.
3.
4.
5.
—
>54
—
Total capacitance Ct = Cj (Chip Junction Capacitance) + Cp (Parasitic Package Capacitance)
Diode attached to an infinite heatsink.
De-rate linearly by -50 mw/°C to 0W @ +125 °C .
Diode in air.
De-rate linearly by -19.3 mw/°C to 0W @ +125 °C
Typical DC Performance Curves
Series Resistance vs. Forward Current
7
Capacitance vs. Reverse Voltage
0.54
6
0.53
Capacitance (pF)
5
0.52
Rs (Ohms)
4
100 MHz
0.51
100 MHz
0.5
3
0.49
2
0.48
1
0.47
0
0
20
40
60
80
100
0.46
0
20
40
60
80
100
Forward Bias (mA)
2
Reverse Bias (V)
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
Typical RF Performance Curves (50 – 4000 MHz)
MOUNTED IN A SERIES CONFIGURATION
V1
Input Return Loss
0
0
Output Return Loss
-10
-10
S11 Mag (dB)
-20
S22 Mag (dB)
0
1
2
3
4
-20
-30
-30
-40
-40
-50
-50
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
Insertion Loss
0
Isolation
0
-0.1
Insertion Loss (dB)
IL (10mA)
IL (50mA)
IL (100mA)
-10
Isolation (dB)
-0.2
-20
-10V
-25V
-30
-0.3
-0.4
-40
-0.5
0
1
2
3
4
-50
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
Typical RF Performance Curves (50 – 4000 MHz)
MOUNTED IN A SHUNT CONFIGURATION
V1
Input Return Loss
0
0
Output Return Loss
-10
-10
S11 Mag (dB)
S22 Mag (dB)
-20
-20
-30
-30
-40
-40
-50
0
1
2
3
4
-50
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
Insertion Loss
0
-0.2
-0.4
-0.6
-0.8
IL (10V)
-1
-1.2
-30
-1.4
-1.6
0
1
2
3
4
-35
0
1
0
Isolation
-5
Insertion Loss (dB)
-10
Isolation (dB)
-15
-20
10mA
50mA
100mA
-25
2
3
4
Frequency (GHz)
Frequency (GHz)
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADP-000504-10720T
Non Magnetic MELF PIN Diode
V1
Package Outline (1072 MELF )
Cathode
A
Circuit Pad Layout
B
Solderable
Surfaces
A
Dimension
Package Style
1072
inches
mm
C
A
INCHES
MIN.
0.080
0.115
0.008
MAX.
0.095
0.125
0.023
MIN.
2.032
2.921
0.203
MM
MAX.
2.413
3.175
0.584
A
0.093
0.050
0.060
2.36
1.27
1.52
Dimension
A
B
C
5
B
C
B
C
B
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
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