MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
包装说明 | SIMM, SSIM72 |
Reach Compliance Code | unknown |
最长访问时间 | 80 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PSMA-N72 |
内存密度 | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE |
内存宽度 | 32 |
端子数量 | 72 |
字数 | 524288 words |
字数代码 | 512000 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX32 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SIMM |
封装等效代码 | SSIM72 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 512 |
自我刷新 | NO |
最大待机电流 | 0.016 A |
最大压摆率 | 0.576 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | SINGLE |
MCM32512SG80 | MCM32L512S10 | MCM32L512SG10 | MCM32L512S80 | MCM32512S80 | MCM32512SG10 | MCM32L512SG70 | |
---|---|---|---|---|---|---|---|
描述 | MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC | MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 80 ns | 100 ns | 100 ns | 80 ns | 80 ns | 100 ns | 70 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512KX32 | 512KX32 | 512KX32 | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
封装等效代码 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
自我刷新 | NO | NO | NO | NO | NO | NO | NO |
最大待机电流 | 0.016 A | 0.0032 A | 0.0032 A | 0.0032 A | 0.016 A | 0.016 A | 0.0032 A |
最大压摆率 | 0.576 mA | 0.496 mA | 0.496 mA | 0.576 mA | 0.576 mA | 0.496 mA | 0.656 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
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