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SI4432-B1

产品描述SPECIALTY TELECOM CIRCUIT, QCC20
产品类别热门应用    无线/射频/通信   
文件大小737KB,共74页
制造商SILABS
官网地址http://www.silabs.com
下载文档 详细参数 选型对比 全文预览

SI4432-B1概述

SPECIALTY TELECOM CIRCUIT, QCC20

专业电信电路, QCC20

SI4432-B1规格参数

参数名称属性值
功能数量1
端子数量20
最大工作温度85 Cel
最小工作温度-40 Cel
额定供电电压3 V
加工封装描述LEAD FREE, MO-220VGGD-8, QFN-20
状态ACTIVE
包装形状SQUARE
包装尺寸CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
表面贴装Yes
端子形式NO LEAD
端子间距0.5000 mm
端子位置QUAD
包装材料UNSPECIFIED
温度等级INDUSTRIAL
通信类型TELECOM CIRCUIT

文档预览

下载PDF文档
Si4430/31/32-B1
Si4430/31/32 ISM T
RANSCEIVER
Features
Frequency Range

240–930 MHz (Si4431/32)

900–960 MHz (Si4430)
Sensitivity = –121 dBm
Output power range

+20 dBm Max (Si4432)

+13 dBm Max (Si4430/31)
Low Power Consumption

18.5 mA receive

30 mA @ +13 dBm transmit

85 mA @ +20 dBm transmit
Data Rate = 0.123 to 256 kbps
FSK, GFSK, and OOK modulation
Power Supply = 1.8 to 3.6 V
Ultra low power shutdown mode
Digital RSSI
Wake-up timer
Auto-frequency calibration (AFC)
Power-on-reset (POR)
Antenna diversity and TR switch
control
Configurable packet handler
Preamble detector
TX and RX 64 byte FIFOs
Low battery detector
Temperature sensor and 8-bit ADC
–40 to +85 °C temperature range
Integrated voltage regulators
Frequency hopping capability
On-chip crystal tuning
20-Pin QFN package
Low BOM
Ordering Information:
See page 67.
Pin Assignments
Si4430/31/32
XOUT
nSEL
15 SCLK
14 SDI
13 SDO
12 VDD_DIG
7
GPIO_0
8
GPIO_1
9
GPIO_2
10 11 NC
VR_DIG
nIRQ
SDN
XIN
Applications
Remote control
Home security & alarm
Telemetry
Personal data logging
Toy control
Tire pressure monitoring
Wireless PC peripherals
Remote meter reading
Remote keyless entry
Home automation
Industrial control
Sensor networks
Health monitors
Tag readers
VDD_RF 1
TX 2
RXp 3
RXn 4
NC 5
6
ANT
20 19 18 17 16
GND
PAD
Description
Silicon Laboratories’ Si4430/31/32 devices are highly integrated, single chip
wireless ISM transceivers. The high-performance EZRadioPRO
®
family includes
a complete line of transmitters, receivers, and transceivers allowing the RF
system designer to choose the optimal wireless part for their application.
The Si4430/31/32’s high level of integration offers reduced BOM cost while
simplifying the overall system design. The extremely low receive sensitivity
(–121 dBm) coupled with industry leading +20 dBm output power ensures
extended range and improved link performance. Built-in antenna diversity and
support for frequency hopping can be used to further extend range and enhance
performance.
The Si4430/31/32 offers advanced radio features including continuous frequency
coverage from 240–960 MHz in 156 Hz or 312 Hz steps allowing precise tuning
control. Additional system features such as an automatic wake-up timer, low
battery detector, 64 byte TX/RX FIFOs, automatic packet handling, and preamble
detection reduce overall current consumption and allow the use of lower-cost
system MCUs. An integrated temperature sensor, general purpose ADC, power-
on-reset (POR), and GPIOs further reduce overall system cost and size.
The Si4430/31/32’s digital receive architecture features a high-performance ADC
and DSP based modem which performs demodulation, filtering, and packet
handling for increased flexibility and performance. The direct digital transmit
modulation and automatic PA power ramping ensure precise transmit modulation
and reduced spectral spreading ensuring compliance with global regulations
including FCC, ETSI, ARIB, and 802.15.4d regulations.
An easy-to-use calculator is provided to quickly configure the radio settings,
simplifying customer's system design and reducing time to market.
Rev 1.1 10/10
Copyright © 2010 by Silicon Laboratories
Patents pending
Si4430/31/32

SI4432-B1相似产品对比

SI4432-B1 SI4430-B1 SI4431-B1 SI4430-B1-FM SI4431-B1-FM
描述 SPECIALTY TELECOM CIRCUIT, QCC20 SPECIALTY TELECOM CIRCUIT, QCC20 SPECIALTY TELECOM CIRCUIT, QCC20 SPECIALTY TELECOM CIRCUIT, QCC20 SPECIALTY TELECOM CIRCUIT, QCC20
功能数量 1 1 1 1 1
端子数量 20 20 20 20 20
最大工作温度 85 Cel 85 Cel 85 Cel 85 Cel 85 Cel
最小工作温度 -40 Cel -40 Cel -40 Cel -40 Cel -40 Cel
额定供电电压 3 V 3 V 3 V 3 V 3 V
加工封装描述 LEAD FREE, MO-220VGGD-8, QFN-20 LEAD FREE, MO-220VGGD-8, QFN-20 LEAD FREE, MO-220VGGD-8, QFN-20 LEAD FREE, MO-220VGGD-8, QFN-20 LEAD FREE, MO-220VGGD-8, QFN-20
状态 ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
包装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
包装尺寸 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
表面贴装 Yes Yes Yes Yes Yes
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子间距 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm 0.5000 mm
端子位置 QUAD QUAD QUAD QUAD QUAD
包装材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
通信类型 TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
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