电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

GS8162Z18B-225IT

产品描述ZBT SRAM, 1MX18, 6ns, CMOS, PBGA119, FBGA-119
产品类别存储    存储   
文件大小1MB,共35页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
下载文档 详细参数 全文预览

GS8162Z18B-225IT概述

ZBT SRAM, 1MX18, 6ns, CMOS, PBGA119, FBGA-119

GS8162Z18B-225IT规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称GSI Technology
零件包装代码BGA
包装说明BGA, BGA119,7X17,50
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间6 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
最大时钟频率 (fCLK)225 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B119
JESD-609代码e0
长度22 mm
内存密度18874368 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量119
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA119,7X17,50
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2.5,2.5/3.3 V
认证状态Not Qualified
座面最大高度1.99 mm
最大待机电流0.03 A
最小待机电流2.38 V
最大压摆率0.245 mA
最大供电电压 (Vsup)2.7 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm

文档预览

下载PDF文档
GS8162Z18(B/D)/GS8162Z36(B/D)
119, 165-bump BGA
Commercial Temp
Industrial Temp
Features
• NBT (No Bus Turn Around) functionality allows zero wait
Read-Write-Read bus utilization; fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• User-configurable Pipeline and Flow Through mode
• ZQ mode pin for user-selectable high/low output drive
• IEEE 1149.1 JTAG-compatible Boundary Scan
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2M, 4M, and 8M devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 119- and 165-Bump BGA packages
18Mb Pipelined and Flow Through
Synchronous NBT SRAM
250 MHz–133 MHz 2.5
V or 3.3 V V
DD
2.5 V or 3.3 V I/O
Because it is a synchronous device, address, data inputs, and
read/write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8162Z18(B/D)/36(B/D) may be configured by the user
to operate in Pipeline or Flow Through mode. Operating as a
pipelined synchronous device, in addition to the rising-edge-
triggered registers that capture input signals, the device
incorporates a rising edge triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge-triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.
The GS8162Z18(B/D)/36(B/D) is implemented with GSI's
high performance CMOS technology and is available in a
JEDEC-standard 119-bump and 165-bump BGA packages.
Functional Description
The GS8162Z18(B/D)/36(B/D) is an 18Mbit Synchronous
Static SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL
or other pipelined read/double late write or flow through read/
single late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Parameter Synopsis
-250
Pipeline
3-1-1-1
3.3 V
2.5 V
Flow Through
2-1-1-1
3.3 V
2.5 V
t
KQ
tCycle
Curr (x18)
Curr (x36)
Curr (x18)
Curr (x36)
t
KQ
tCycle
Curr (x18)
Curr (x36)
Curr (x18)
Curr (x36)
2.5
4.0
280
330
275
320
5.5
5.5
175
200
175
200
-225
2.7
4.4
255
300
250
295
6.0
6.0
165
190
165
190
-200
3.0
5.0
230
270
230
265
6.5
6.5
160
180
160
180
-166
3.4
6.0
200
230
195
225
7.0
7.0
150
170
150
170
-150
3.8
6.7
185
215
180
210
7.5
7.5
145
165
145
165
-133
4.0
7.5
165
190
165
185
8.5
8.5
135
150
135
150
Unit
ns
ns
mA
mA
mA
mA
ns
ns
mA
mA
mA
mA
Rev: 2.22 11/2005
1/35
© 1999, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
?这个程序这样有错误吗?
//一个工程文件中 * char USART_Receive(void) { while (!(UCSR0A&(1 < ...
fgfgfg 嵌入式系统
DRV8811 pdf
DRV8811 pdf 芯片资料...
laozheng7355 嵌入式系统
TMS320F28035的sci串口烧录基础知识
引导加载程序(BootLoader-在TI给的应用手册中有讲的很详细)是位于片内引导ROM中的程序,它在复位后执行。引导加载程序用于在加电后将代码从外部源传输到内部存储器(即将 I/O口接收到的代码 ......
fish001 DSP 与 ARM 处理器
有没有好的国产EDA设计软件
有没有好的国产EDA设计软件?另外,一个做软件开发的人(没有电子电路知识基础),有没有可能转型硬件开发设计? ...
kernelkoder PCB设计
请问反馈型LC振荡电路的Q值是怎么推导出来的?
请问反馈型LC振荡器的Q值怎么推导出来的?电路图如图所示,希望大神们能给一个详细的推导过程。谢谢! ...
tkjl12 模拟电子
【BLE 5.3无线MCU CH582】14、ble串口透传测试
系列文章: 【BLE 5.3无线MCU CH582】1、初识CH582开发板(开箱) 【BLE 5.3无线MCU CH582】2、MounRiver IDE初体验 【BLE 5.3无线MCU CH582】3、非阻塞方式点灯 【BLE 5.3无线MCU ......
freeelectron 国产芯片交流

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 804  886  2063  124  1928  51  28  38  24  1 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved