Standard SRAM, 8KX8, 250ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SANYO |
零件包装代码 | SOIC |
包装说明 | SOP, SOP28,.45 |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 250 ns |
其他特性 | USER SELECTABLE 4.5V TO 5.5V SUPPLY |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 18 mm |
内存密度 | 65536 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 28 |
字数 | 8192 words |
字数代码 | 8000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 8KX8 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP28,.45 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
电源 | 3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 2.5 mm |
最大待机电流 | 0.0000025 A |
最小待机电流 | 2 V |
最大压摆率 | 0.04 mA |
最大供电电压 (Vsup) | 3.3 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 8.4 mm |
LC3564SM-85 | LC3564SM-10 | LC3564SS-85 | LC3564SS-70 | LC3564S-85 | LC3564S-70 | LC3564SS-10 | |
---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 8KX8, 250ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 | Standard SRAM, 8KX8, 500ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 | Standard SRAM, 8KX8, 250ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 200ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 500ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | SANYO | SANYO | SANYO | SANYO | SANYO | SANYO | SANYO |
零件包装代码 | SOIC | SOIC | DIP | DIP | DIP | DIP | DIP |
包装说明 | SOP, SOP28,.45 | SOP, SOP28,.45 | DIP, DIP28,.3 | DIP, DIP28,.3 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.3 |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 250 ns | 500 ns | 250 ns | 200 ns | 250 ns | 200 ns | 500 ns |
其他特性 | USER SELECTABLE 4.5V TO 5.5V SUPPLY | USER SELECTABLE 4.5V TO 5.5V SUPPLY | USER SELECTABLE 4.5V TO 5.5V SUPPLY | USER SELECTABLE 4.5V TO 5.5V SUPPLY | USER SELECTABLE 4.5V TO 5.5V SUPPLY | USER SELECTABLE 4.5V TO 5.5V SUPPLY | USER SELECTABLE 4.5V TO 5.5V SUPPLY |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 18 mm | 18 mm | 35.5 mm | 35.5 mm | 37.9 mm | 37.9 mm | 35.5 mm |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | SOP28,.45 | SOP28,.45 | DIP28,.3 | DIP28,.3 | DIP28,.6 | DIP28,.6 | DIP28,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.5 mm | 2.5 mm | 3.86 mm | 3.86 mm | 5.1 mm | 5.1 mm | 3.86 mm |
最大待机电流 | 0.0000025 A | 0.0000025 A | 0.0000025 A | 0.0000025 A | 0.0000025 A | 0.0000025 A | 0.0000025 A |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最大压摆率 | 0.04 mA | 0.035 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.035 mA |
最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 8.4 mm | 8.4 mm | 7.62 mm | 7.62 mm | 15.24 mm | 15.24 mm | 7.62 mm |
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