Pseudo Static RAM, 64KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
| 参数名称 | 属性值 |
| 厂商名称 | SANYO |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP32,.6 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 70 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDIP-T32 |
| 长度 | 41.9 mm |
| 内存密度 | 524288 bit |
| 内存集成电路类型 | PSEUDO STATIC RAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 32 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX8 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP32,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大待机电流 | 0.001 A |
| 最大压摆率 | 0.08 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| LC33864P-70 | LC33864ML-70 | LC33864PL-80 | LC33864PL-10 | LC33864PL-70 | LC33864P-10 | LC33864ML-10 | LC33864ML-80 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Pseudo Static RAM, 64KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Pseudo Static RAM, 64KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | Pseudo Static RAM, 64KX8, 80ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Pseudo Static RAM, 64KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Pseudo Static RAM, 64KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Pseudo Static RAM, 64KX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Pseudo Static RAM, 64KX8, 100ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 | Pseudo Static RAM, 64KX8, 80ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 |
| 厂商名称 | SANYO | SANYO | SANYO | SANYO | SANYO | SANYO | SANYO | SANYO |
| 零件包装代码 | DIP | SOIC | DIP | DIP | DIP | DIP | SOIC | SOIC |
| 包装说明 | DIP, DIP32,.6 | SOP, SOP32,.56 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | SOP, SOP32,.56 | SOP, SOP32,.56 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 70 ns | 70 ns | 80 ns | 100 ns | 70 ns | 100 ns | 100 ns | 80 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDIP-T32 | R-PDSO-G32 | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 |
| 长度 | 41.9 mm | 20.7 mm | 41.9 mm | 41.9 mm | 41.9 mm | 41.9 mm | 20.7 mm | 20.7 mm |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bi |
| 内存集成电路类型 | PSEUDO STATIC RAM | PSEUDO STATIC RAM | PSEUDO STATIC RAM | PSEUDO STATIC RAM | PSEUDO STATIC RAM | PSEUDO STATIC RAM | PSEUDO STATIC RAM | PSEUDO STATIC RAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | DIP | DIP | DIP | SOP | SOP |
| 封装等效代码 | DIP32,.6 | SOP32,.56 | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 | SOP32,.56 | SOP32,.56 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 3.2 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 3.2 mm | 3.2 mm |
| 最大待机电流 | 0.001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.08 mA | 0.08 mA | 0.07 mA | 0.06 mA | 0.08 mA | 0.06 mA | 0.06 mA | 0.07 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 11.2 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 11.2 mm | 11.2 mm |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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