IC HALF BRDG BASED MOSFET DRIVER, PDSO8, SOIC-8, MOSFET Driver
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ON Semiconductor(安森美) |
零件包装代码 | SOIC |
包装说明 | SOIC-8 |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
高边驱动器 | YES |
接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 代码 | R-PDSO-G8 |
长度 | 4.9 mm |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 | 13.2 V |
最小供电电压 | 4.6 V |
标称供电电压 | 12 V |
表面贴装 | YES |
温度等级 | OTHER |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3.9 mm |
NCP3418BPDR2G | NCP3418APDR2G | NCP3418PDG | NCP3418DG | NCP3418PDR2G | |
---|---|---|---|---|---|
描述 | IC HALF BRDG BASED MOSFET DRIVER, PDSO8, SOIC-8, MOSFET Driver | HALF BRDG BASED MOSFET DRIVER, PDSO8, SOIC-8 | IC HALF BRDG BASED MOSFET DRIVER, PDSO8, SOIC-8, MOSFET Driver | IC HALF BRDG BASED MOSFET DRIVER, PDSO8, SOIC-8, MOSFET Driver | HALF BRDG BASED MOSFET DRIVER, PDSO8, SOIC-8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | SOIC-8 | SOIC-8 | SOIC-8 | SOIC-8 | SOIC-8 |
针数 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
高边驱动器 | YES | YES | YES | YES | YES |
接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HSOP | HSOP | HSOP | SOP | HSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG | SMALL OUTLINE, HEAT SINK/SLUG | SMALL OUTLINE, HEAT SINK/SLUG | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
最大供电电压 | 13.2 V | 13.2 V | 13.2 V | 13.2 V | 13.2 V |
最小供电电压 | 4.6 V | 4.6 V | 4.6 V | 4.6 V | 4.6 V |
标称供电电压 | 12 V | 12 V | 12 V | 12 V | 12 V |
表面贴装 | YES | YES | YES | YES | YES |
温度等级 | OTHER | COMMERCIAL EXTENDED | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
断开时间 | - | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs |
接通时间 | - | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs |
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