DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 5.30 X 0.65 MM, SSOP-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | SOIC |
包装说明 | 5.30 X 0.65 MM, SSOP-16 |
针数 | 16 |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | SPST |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
长度 | 6.2 mm |
湿度敏感等级 | 1 |
负电源电压最大值(Vsup) | -20 V |
负电源电压最小值(Vsup) | -4.5 V |
标称负供电电压 (Vsup) | -15 V |
信道数量 | 1 |
功能数量 | 2 |
端子数量 | 16 |
标称断态隔离度 | 53 dB |
通态电阻匹配规范 | 0.05 Ω |
最大通态电阻 (Ron) | 1 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 245 |
认证状态 | COMMERCIAL |
座面最大高度 | 1.99 mm |
最大供电电压 (Vsup) | 20 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 5.29 mm |
MAX4590EAE | MAX4600CWE | MAX4590CWE | MAX4590EPE | MAX4600CPE | MAX4600EPE | |
---|---|---|---|---|---|---|
描述 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 5.30 X 0.65 MM, SSOP-16 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.300 INCH, MS-013AA, SOIC-16 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.300 INCH, MS-013AA, SOIC-16 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, PLASTIC, DIP-16 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, PLASTIC, DIP-16 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, PLASTIC, DIP-16 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
零件包装代码 | SOIC | SOIC | SOIC | DIP | DIP | DIP |
包装说明 | 5.30 X 0.65 MM, SSOP-16 | SOP, | SOP, | DIP, | DIP, | DIP, |
针数 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 6.2 mm | 10.3 mm | 10.3 mm | 19.175 mm | 19.175 mm | 19.175 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
负电源电压最大值(Vsup) | -20 V | -20 V | -20 V | -20 V | -20 V | -20 V |
负电源电压最小值(Vsup) | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最大通态电阻 (Ron) | 1 Ω | 1 Ω | 1 Ω | 1 Ω | 1 Ω | 1 Ω |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | SOP | SOP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | 245 | 240 | 240 | 240 | 240 | 240 |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 1.99 mm | 2.65 mm | 2.65 mm | 4.572 mm | 4.572 mm | 4.572 mm |
最大供电电压 (Vsup) | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
表面贴装 | YES | YES | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | 20 | 20 | 20 | 20 |
宽度 | 5.29 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.62 mm |
厂商名称 | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
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