Further Information .............................................15
November 2016 - Version 1
1/17
Figure 1
Functional block diagram of the STS3x-DIS. The
CMOSens™ technology allows providing for a fully
calibrated I
2
C signal.
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Datasheet STS3x-DIS
1
1.1
Sensor Performance
Temperature Sensor Performance
Condition
typ., 0°C to 65°C
typ., -40°C to 90°C
Low
Medium
High
Typ.
-
63%
max
Parameter
Accuracy tolerance
1
STS30-DIS
Accuracy tolerance
1
STS31-DIS
Repeatability
2
Resolution
Specified Range
Response time
3
Long Term Drift
Table 1
Temperature sensor specification.
Value
0.3
0.3
0.24
0.12
0.06
0.015
-40 to 125
>2
<0.03
Units
°C
°C
°C
°C
°C
°C
°C
s
°C/yr
STS30
DT
(°C)
±1.5
maximal tolerance
typical tolerance
±1.0
±1.0
DT
(°C)
±1.5
STS31
maximal tolerance
typical tolerance
±0.5
±0.5
±0.0
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
±0.0
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
Figure 2
Temperature accuracy of the STS30 sensor.
Figure 3
Temperature accuracy of the STS31 sensor.
1
For definition of typical and maximum accuracy tolerance, please refer to the document “Sensirion Humidity Sensor Specification Statement”.
2
The stated repeatability is 3 times the standard deviation (3σ) of multiple consecutive measurements at the stated repeatability and at constant ambient conditions. It
is a measure for the noise on the physical sensor output.
3
Temperature response times strongly depend on the type of heat exchange, the available sensor surface and the design environment of the sensor in the final
application.
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2
2.1
Specifications
Electrical Specifications
Symbol
V
DD
V
POR
Parameter
Supply voltage
Power-up/down level
Condition
Min.
2.4
2.1
Typ.
3.3
2.3
Max.
5.5
2.4
Units Comments
V
V
Voltage changes on the
VDD line between
V
DD,min
and V
DD
,
max
V/ms should be slower than
the maximum slew rate;
faster slew rates may
lead to reset;
Current when sensor is
not performing a
A
measurement during
single shot mode
Current when sensor is
not performing a
A
measurement during
periodic data acquisition
mode
Current consumption
A
while sensor is
measuring
Current consumption
(operation with one
measurement per
A
second at lowest
repeatability, single shot
mode)
mA
mW
See also section 3.5
Depending on the
supply voltage
Slew rate change of the
supply voltage
V
DD,slew
-
-
20
idle state
(single shot mode)
-
0.2
2.0
idle state
(periodic data
acquisition mode)
Supply current
I
DD
Measuring
-
45
70
-
800
1500
Average
-
2
-
Alert Output driving
strength
Heater power
IOH
P
Heater
Heater running
0.8x V
DD
1.5x V
DD
4.5
-
2.1x V
DD
33
Table 2
Electrical specifications, valid at 25°C.
2.2
Timing Specification for the Sensor System
Symbol
t
PU
Parameter
Power-up time
Conditions
After hard reset,
V
DD
≥ V
POR
After soft reset.
Min.
-
Typ.
0.5
Max.
1
Units Comments
ms
Time between V
DD
reaching
V
POR
and sensor entering idle
state
Time between ACK of soft
reset command and sensor
entering idle state
See section 3.6
The three repeatability modes
differ with respect to
measurement duration, noise
level and energy consumption
Soft reset time
Duration of reset pulse
Measurement duration
t
SR
t
RESETN
t
MEAS,l
t
MEAS,m
t
MEAS,h
-
1
0.5
-
2.5
4.5
12.5
1
-
4
6
15
ms
µs
ms
ms
ms
Low repeatability
Medium repeatability
High repeatability
Table 3
System timing specification, valid from -40 °C to 125 °C and 2.4 V to 5.5 V.
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2.3
Absolute Minimum and Maximum Ratings
Stress levels beyond those listed in Table 4 may cause permanent damage to the device or affect the reliability of the
sensor. These are stress ratings only and functional operation of the device at these conditions is not guaranteed.
Parameter
Rating
Units
V
V
mA
°C
°C
kV
V
Supply voltage V
DD
-0.3 to 6
Max Voltage on pins (pin 1 (SDA); pin 2 (ADDR); pin 3 (ALERT); pin 4
-0.3 to VDD+0.3
(SCL); pin 6 (nRESET))
Input current on any pin
±100
Operating temperature range
-40 to 125
Storage temperature range
-40 to 150
ESD HBM (human body model)
4
4
ESD CDM (charge device model)
5
750
Table 4
Minimum and maximum ratings; values may only be applied for short time periods.
4
5
According to ANSI/ESDA/JEDEC JS-001-2014; AEC-Q100-002.
According to ANSI/ESD S5.3.1-2009; AEC-Q100-011.
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3
Pin Assignment
frequencies up to 1 MHz are supported following the
specifications given in
Table 18
.
Both SCL and SDA lines are open-drain I/Os with diodes
to VDD and VSS. They should be connected to external
pull-up resistors (please refer to Figure 4). A device on
the I2C bus must only drive a line to ground. The external
pull-up resistors (e.g. R
p
=10 kΩ) are required to pull the
signal high. For dimensioning resistor sizes please take
bus capacity and communication frequency into account
(see for example Section 7.1 of NXPs I2C Manual for
more details
6
). It should be noted that pull-up resistors
may be included in I/O circuits of microcontrollers. It is
recommended to wire the sensor according to the
application circuit as shown in Figure 4.
V
DD
R
P
R
P
The STS3x-DIS comes in a tiny 8-pin DFN package –
see Table 5.
Pin
1
2
3
4
5
6
7
8
Name
SDA
ADDR
ALERT
SCL
VDD
nRESET
R
Comments
Serial data; input / output
Address pin; input; connect to either
logic high or low, do not leave
floating
Indicates alarm condition; output;
must be left floating if unused
Serial clock; input / output
Supply voltage; input
Reset pin active low; input; if not
used it is recommended to be left
floating
No electrical function; to be
connected to VSS
Ground
100nF
nRESET
(6)
ALERT
(3)
ADDR
(2)
VSS
(8)
pad
die
VDD
(5)
SCL
(4)
SDA
(1)
R
(7)
1
2
3
4
8
7
6
5
Table 5
STS3x-DIS pin assignment (transparent top view).
Dashed lines are only visible if viewed from below. The die
pad is internally connected to .
Figure 4
Typical application circuit. Please note that the
positioning of the pins does not reflect the position on the
real sensor. This is shown in Table 5.
3.3
Die Pad (center pad)
3.1
Power Pins (VDD, VSS)
The electrical specifications of the STS3x-DIS are shown
in Table 2. The power supply pins must be decoupled
with a 100 nF capacitor that shall be placed as close to
the sensor as possible – see Figure 4 for a typical
application circuit.
The die pad or center pad is visible from below and
located in the center of the package. It is electrically
connected to . Hence electrical considerations do not
impose constraints on the wiring of the die pad.
However, due to mechanical reasons it is recommended
to solder the center pad to the PCB. For more
information on design-in, please refer to the document
“SHTxx Design Guide”.
3.2
Serial Clock and Serial Data (SCL, SDA)
3.4
ADDR Pin
SCL is used to synchronize the communication between
microcontroller and the sensor. The clock frequency can
be freely chosen between 0 to 1000 kHz. Commands
with clock stretching according to I2C Standard
6
are
supported.
The SDA pin is used to transfer data to and from the
sensor. Communication with frequencies up to 400 kHz
must meet the I2C
Fast Mode
6
standard. Communication
Through the appropriate wiring of the ADDR pin the I2C
address can be selected (see Table 6 for the respective
addresses). The ADDR pin can either be connected to
logic high or logic low, or it can be used as a selector pin.
This means that the address of the sensor can be
changed dynamically during operation by switching the
level on the ADDR pin. The only constraint is that the
level has to stay constant starting from the I2C start
condition until the communication is finished. This allows
to connect more than two STS3x-DIS onto the same bus.
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