IC 18 A BUF OR INV BASED PRPHL DRVR, PZFM5, PLASTIC, TO-220, SOT-263B-01, SEP-5, Peripheral Driver
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SFM |
包装说明 | PLASTIC, TO-220, SOT-263B-01, SEP-5 |
针数 | 3 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
内置保护 | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
驱动器位数 | 1 |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-PZFM-T5 |
功能数量 | 1 |
端子数量 | 5 |
最高工作温度 | 150 °C |
最低工作温度 | -40 °C |
输出电流流向 | SOURCE |
最大输出电流 | 8.5 A |
标称输出峰值电流 | 18 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TO-220 |
封装等效代码 | ZIP5,.15,.17,67TB |
封装形状 | RECTANGULAR |
封装形式 | FLANGE MOUNT |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5.5/35 V |
认证状态 | Not Qualified |
最大供电电压 | 35 V |
最小供电电压 | 5.5 V |
标称供电电压 | 13 V |
表面贴装 | NO |
技术 | MOS |
温度等级 | AUTOMOTIVE |
端子形式 | THROUGH-HOLE |
端子节距 | 1.7 mm |
端子位置 | ZIG-ZAG |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
断开时间 | 120 µs |
接通时间 | 160 µs |
BUK208-50Y | BUK208-50Y,127 | BUK213-50Y,118 | |
---|---|---|---|
描述 | IC 18 A BUF OR INV BASED PRPHL DRVR, PZFM5, PLASTIC, TO-220, SOT-263B-01, SEP-5, Peripheral Driver | MOSFET N-CH 50V 8.5A SOT263 | MOSFET N-CH 50V 8.5A SOT263 |
零件包装代码 | SFM | SFM | D2PAK |
包装说明 | PLASTIC, TO-220, SOT-263B-01, SEP-5 | PLASTIC, TO-220, SOT-263B-01, SEP-5 | PLASTIC, SOT-426, D2PAK-5 |
针数 | 3 | 3 | 5 |
Reach Compliance Code | unknown | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 |
内置保护 | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE |
驱动器位数 | 1 | 1 | 1 |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | R-PZFM-T5 | R-PZFM-T5 | R-PSSO-G4 |
功能数量 | 1 | 1 | 1 |
端子数量 | 5 | 5 | 4 |
最高工作温度 | 150 °C | 150 °C | 150 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
输出电流流向 | SOURCE | SINK | SINK |
最大输出电流 | 8.5 A | 8.5 A | 8.5 A |
标称输出峰值电流 | 18 A | 3.6 A | 3.6 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TO-220 | TO-220 | TO-263 |
封装等效代码 | ZIP5,.15,.17,67TB | ZIP5,.15,.17,67TB | SMSIP5H,.6,67TB |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLANGE MOUNT | FLANGE MOUNT | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5.5/35 V | 5.5/35 V | 5.5/35 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 | 35 V | 35 V | 35 V |
最小供电电压 | 5.5 V | 5.5 V | 5.5 V |
标称供电电压 | 13 V | 13 V | 13 V |
表面贴装 | NO | NO | YES |
技术 | MOS | MOS | MOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.7 mm | 1.7 mm | 1.7 mm |
端子位置 | ZIG-ZAG | ZIG-ZAG | SINGLE |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
断开时间 | 120 µs | 120 µs | 120 µs |
接通时间 | 160 µs | 160 µs | 160 µs |
是否Rohs认证 | 符合 | - | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | - |
Base Number Matches | - | 1 | 1 |
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