SN54AS34FKR概述

AS SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20

SN54AS34FKR规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
零件包装代码	QLCC
包装说明	QCCN,
针数	20
Reach Compliance Code	unknown
系列	AS
JESD-30 代码	S-CQCC-N20
长度	8.89 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUFFER
功能数量	6
输入次数	1
端子数量	20
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装形状	SQUARE
封装形式	CHIP CARRIER
最大电源电流（ICC）	34.6 mA
传播延迟（tpd）	7 ns
认证状态	Not Qualified
座面最大高度	2.03 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	TTL
温度等级	MILITARY
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	QUAD
宽度	8.89 mm

SN54AS34FKR相似产品对比

	SN54AS34FKR	SNJ54ALS34FK	SNJ54ALS34FKR	SNJ54ALS34J	SN54ALS34FKR	SNJ54AS34FKR	SNJ54AS34J	SNJ54AS34FK
描述	AS SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20	ALS SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20	ALS SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20	ALS SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, 0.300 INCH, CERAMIC, DIP-14	ALS SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20	AS SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20	AS SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP14, 0.300 INCH, CERAMIC, DIP-14	AS SERIES, HEX 1-INPUT NON-INVERT GATE, CQCC20, CERAMIC, LCC-20
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
零件包装代码	QLCC	QLCC	QLCC	DIP	QLCC	QLCC	DIP	QLCC
包装说明	QCCN,	QCCN, LCC20,.35SQ	QCCN,	DIP, DIP14,.3	CERAMIC, LCC-20	CERAMIC, LCC-20	DIP, DIP14,.3	QCCN, LCC20,.35SQ
针数	20	20	20	14	20	20	14	20
Reach Compliance Code	unknown	not_compliant	unknown	not_compliant	unknown	unknown	not_compliant	_compli
系列	AS	ALS	ALS	ALS	ALS	AS	AS	AS
JESD-30 代码	S-CQCC-N20	S-CQCC-N20	S-CQCC-N20	R-GDIP-T14	S-CQCC-N20	S-CQCC-N20	R-GDIP-T14	S-CQCC-N20
长度	8.89 mm	8.89 mm	8.89 mm	19.56 mm	8.89 mm	8.89 mm	19.56 mm	8.89 mm
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
功能数量	6	6	6	6	6	6	6	6
输入次数	1	1	1	1	1	1	1	1
端子数量	20	20	20	14	20	20	14	20
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN	QCCN	QCCN	DIP	QCCN	QCCN	DIP	QCCN
封装形状	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE
封装形式	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER
最大电源电流（ICC）	34.6 mA	8 mA	8 mA	8 mA	8 mA	34.6 mA	34.6 mA	34.6 mA
传播延迟（tpd）	7 ns	18 ns	18 ns	18 ns	18 ns	7 ns	7 ns	7 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.03 mm	2.03 mm	2.03 mm	5.08 mm	2.03 mm	2.03 mm	5.08 mm	2.03 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	NO	YES	YES	NO	YES
技术	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	DUAL	QUAD	QUAD	DUAL	QUAD
宽度	8.89 mm	8.89 mm	8.89 mm	7.62 mm	8.89 mm	8.89 mm	7.62 mm	8.89 mm

SN54AS34FKR

SN54AS34FKR概述

SN54AS34FKR规格参数

SN54AS34FKR相似产品对比

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