Multi-Port SRAM, 4KX8, 15ns, CMOS, PQFP128
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| 最长访问时间 | 15 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQFP-G128 |
| JESD-609代码 | e0 |
| 内存密度 | 32768 bit |
| 内存集成电路类型 | MULTI-PORT SRAM |
| 内存宽度 | 8 |
| 端口数量 | 4 |
| 端子数量 | 128 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP128,.67X.93,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.0015 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.39 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| IDT7054S15PRF | IDT7054L15PRF | IDT7054L45PRF | IDT7054S45PRF | |
|---|---|---|---|---|
| 描述 | Multi-Port SRAM, 4KX8, 15ns, CMOS, PQFP128 | Multi-Port SRAM, 4KX8, 15ns, CMOS, PQFP128 | Multi-Port SRAM, 4KX8, 45ns, CMOS, PQFP128 | Multi-Port SRAM, 4KX8, 45ns, CMOS, PQFP128 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown |
| 最长访问时间 | 15 ns | 15 ns | 45 ns | 45 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 内存密度 | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
| 内存集成电路类型 | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 |
| 端口数量 | 4 | 4 | 4 | 4 |
| 端子数量 | 128 | 128 | 128 | 128 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | QFP |
| 封装等效代码 | QFP128,.67X.93,20 | QFP128,.67X.93,20 | QFP128,.67X.93,20 | QFP128,.67X.93,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0015 A | 0.0003 A | 0.0015 A | 0.0015 A |
| 最小待机电流 | 4.5 V | 2 V | 2 V | 4.5 V |
| 最大压摆率 | 0.39 mA | 0.345 mA | 0.285 mA | 0.33 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
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