Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CDFP20, FP-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL20,.3 |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 系列 | TTL/H/L |
| JESD-30 代码 | R-CDFP-F20 |
| JESD-609代码 | e0 |
| 长度 | 12.827 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | CONFIGURABLE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 34 mA |
| 传播延迟（tpd） | 37 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 座面最大高度 | 2.159 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.731 mm |
| Base Number Matches | 1 |
| AM25LS2538FMB | AM25LS2538PCB | AM25LS2538DCB | AM25LS2538DMB | AM25LS2538LMB | AM25LS2538LCB | |
|---|---|---|---|---|---|---|
| 描述 | Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CDFP20, FP-20 | Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, PDIP20, PLASTIC, DIP-20 | Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 | Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 | Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CQCC20, LCC-20 | Decoder/Driver, TTL/H/L Series, Configurable Output, TTL, CQCC20, LCC-20 |
| 零件包装代码 | DFP | DIP | DIP | DIP | QLCC | QLCC |
| 包装说明 | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | QCCN, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
| JESD-30 代码 | R-CDFP-F20 | R-PDIP-T20 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 |
| 长度 | 12.827 mm | 26.289 mm | 24.4602 mm | 24.4602 mm | 8.89 mm | 8.89 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | DIP | DIP | QCCN | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 最大电源电流（ICC） | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA |
| 传播延迟（tpd） | 37 ns | 29 ns | 29 ns | 37 ns | 37 ns | 29 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.159 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
| 宽度 | 6.731 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - |
| 封装等效代码 | FL20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
